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  • 學位論文

複合相變材料牆板系統設計及數值模擬分析

System Design of Composite Concrete Panels Containing Phase-Change Material and Numerical Simulation Analysis

指導教授 : 陳振川
共同指導教授 : 劉楨業(Tony C.Liu)

摘要


本研究使用單一相變材料與三元複合相變材料,利用粗膠囊化法進行封裝,再與牆板做結合,進行熱貫流試驗,探討含有相變材料之牆板的熱學行為,另外討論相變材料於牆板內部之擺放位置對室內溫度是否有影響,更進一步討論總潛熱值對於相變材料牆板之熱學行為影響;接著使用有限元素軟體ABAQUS模擬牆板於實驗情況,再與實驗結果進行比對。 實驗與模擬結果進行含有相變材料的牆板與無含有相變材料之牆板比較,前者之高溫峰值溫度會較後者低而低溫峰值溫度會升高且有延遲時間的效果;接著由實驗與模擬結果顯示相變材料安裝於靠近試驗側之位置較理想;由實驗結果可知牆板所含之總潛熱值較高者會降低高溫峰值溫度。另外由模擬進行銅管於牆板內之熱學行為影響,可知牆板內含有銅管會造成高溫峰值溫度上升且延遲時間變短。

並列摘要


In this study, a single phase change material and the ternary phase change material are used. Encapsulating by the coarse method, and then conbine with the concrete wall. The hot box test is carried out to explore the thermal behavior of the wall containing the phase change material. The effect to the indoor temperature of the phase change materials' position in the internal wall is discussed, and effect of the total value of the latent heat of phase change materials for thermal behavior as well. The finite element software ABAQUS is used to simulate the behavior of the wallboard in the experimental situation, and compared with the experimental results. Results of the wallboard containing phase change materials and the wallboard without phase change materials are compared, both experiment and simulation show that the former peak temperature of the high temperature is lower than the latter and the low temperature is higher and there is the effect of the delay time. the experiment and simulation results show that the phase change materials which are installed close to the test side is ideal. The panel with the higher total latent heat will reduce the peak of high temperature by the experimental results.Besides, the thermal behavior effects of panel containingsthe copper tube is discussed, it can be seen that wallboard containing copper can cause high peak temperatures rise and the delay time becomes shorter.

參考文獻


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被引用紀錄


楊泓斌(2015)。複合相變材料於建築節能之研究與應用〔博士論文,國立臺灣大學〕。華藝線上圖書館。https://doi.org/10.6342/NTU.2015.02664

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