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  • 學位論文

多層印刷電路板排版方式與製程成本之整合評估與分析

Evaluation and Analysis of Integrated Nesting and Manufacturing Cost of Multilayer Printed Circuit Board

指導教授 : 鄭元杰
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摘要


在印刷電路板的製造過程,是以製程板為單位進行加工,在製程板上可放置多片成品板同時進行加工,但製程板的尺寸大小受到加工時,各製程所使用的加工機台所限制,以及成品板放置的數目與排列方式所影響,將影響實際加工時的製程板尺寸。不同製程板尺寸對加工時物料的使用有相對的關係,而成品板排放的數目與排版方式對加工時的加工時間的長短亦有相當的影響,以上因素均直接影響到生產一片成品板的成本多寡,故在實際製造加工前,需對成品板在製程板上的排版方式配合製程板生產前的裁切方式做成本的評估,以找出最佳成本的製程板排版方式及製程板裁切排列方式進行加工。 本研究針對印刷電路板的成品板在製程板上的排版、製程板在基板上的排列,分別提出規則對稱性的製程板排版、製程板裁切排列方法與成本評估模型,對不同的排版及排列方式進行製程成本與材料浪費成本做整合性的評估,找出最佳的成品板在製程板上的排版方式與製程板在基板上的排列方式,使得基板浪費成本與成品板製造成本兩者之間取得平衡折衷,得到實際加工時的成品板在製程板上的排版方式與製程版在基板上的裁切排列方式,以提供製程規劃時的參考。

關鍵字

印刷電路板 製造成本 排版 裁切

並列摘要


Manufacturing process of Printed Circuit Board(PCB) is processed by panel on which can been put several pieces of boards simultaneously as a unit. But size of panel influenced by working machine and the number and the nesting way of boards will affect actual processing size of the panel. Different panel size has a relation to use of processing material and arranged quantities and nesting way of boards also has a great effect upon the length of processing time. All the above-mentioned factors effect upon how much the cost of producing one piece of board directly. So need to evaluate cost of the nesting way of boards on panel along with the cutting way to unprocessed panel to find out the way of the best cost to process before actual processing. In this research project propose regular-symmetry nesting method of board , cutting and arrangement method of panel and model of manufacturing cost evaluate which focus on boards nesting on panel and panels arrangement on laminate to do integrated evaluation for cost of manufacturing and material waste of different nesting and arrangement ways. To find out the best nesting way of boards on panel and arrangement way of panel on laminate to make a balance between waste cost of laminate and board’s manufacturing cost getting board’s nesting way on panel and panel’s arrangement way on laminate on processing providing reference for manufacturing process planning.

參考文獻


3. 李炎燊,民國八十七年,「多層印刷電路板製程中組裝與加工次序之整合分析與評估」,元智大學,碩士論文。
7. 廖文鈺,民國八十五年,「工業用紙工廠紙張裁剪模式之探討」,元智工學院,碩士論文。
9. Agrawal, P. K., 1993,“Minimising trim loss in cutting rectangular blanks of a single size from a rectangular sheet using orthogonal guillotine”, European Journal of Operational Research, 64, pp.410-422.
10. Carvalho, J.M. V. and Rodrigues, A.J. G., 1995,“An LP-base approach to a two-stage cutting stock problem”, European Journal of Operational Research, 84, pp.580-590.
11. Christofides, N. and Hadjiconstantinou, E., 1995,“An extra algorithm for orthogonal 2-D cutting problems using guillotine cuts”, European Journal of Operational Research, 83, pp.21-38.

被引用紀錄


游葦凡(2013)。改善產品資料管理系統之協同設計績效 -以PCB Layout為例〔碩士論文,中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu201300101
楊金聲(2005)。利用類神經網路與線性迴歸進行成本預測之研究-以印刷電路板產業為例〔碩士論文,中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu200500367
蕭博仁(2000)。應用類神經網路監視語意品質特性平均值之變化--以印刷電路板製程為例〔碩士論文,元智大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0009-0112200611363988
蔣承洋(2001)。整合物料表與生產途程之多層印刷電路板整體物料規劃〔碩士論文,元智大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0009-0112200611333830
高宏璋(2001)。電腦輔助多層印刷電路板製造途程規劃〔碩士論文,元智大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0009-0112200611334922

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