半導體機台自動化延伸 應用於整廠機台效能分析之研究

Equipment Automatic Program Extension in Wafer Fabrication for Overall Equipment Efficiency (OEE) Research

陳正宏(Cheng-Hung Chen)

指導教授 ： 黃士殷

元智大學/資訊學院/資訊工程學系/碩士(2004年)

摘要

機台自動化程式(EAP)是目前八吋以上晶圓廠製程品質管制上不可或缺的程式，當每一批貨生產前後都會經由EAP作確認動作，並且管制晶圓的製程配方及控制機台操作，一但發現異常情形，這批貨將不再從事生產，以防止錯誤的操作以及整批貨報廢不用等情形。在量測機台部分，還會收集晶圓量測相關資料，並且在製程結束後回報給製造執行系統(Manufacture Execution System : MES)作資料分析。

但是這樣的品質管制只能在批貨與批貨之間作控管，對於因為機台(Equipment：EQP)處於不穩定的環境所生產的晶圓，必須作補救措施，如重工(Rework)製程，並無法有效的防範。如此不僅增加產品成本，降低機台使用效能，還會延後交貨日期。因此衍生出先進製程控制(Advanced Process Control : APC)[1]，目前大多數的做法是在安裝機台資料收集器硬體介於EAP和機台連線中，收集APC所需資料，但是卻常造成EAP和機台的連線不穩定，進而影響到工廠自動化的進行。

因此本論文於Microsoft Windows 2000作業系統環境下，以Visual Basic 6.0為開發工具架構系統程式，提出以應用程式方式實作，除了不影響原有的EAP以及提昇連線的穩定性外，還能符合APC需求，進一步並提供半導體機台之即時監控系統所需相關資料。

關鍵字

機台自動化程式 ； 先進製程控制 ； 即時監控

並列摘要

Equipment Automatic Program (EAP) must be a process and quality control program in above 8-inch wafer fab, EAP check every action before each lot process, it control the recipe and equipment operation. If it found out exception, this lot will stop to process.Thus, it can avoid miss-operation and all wafer in this lot usable. In the measure tools, it can collect wafer measure data and response them to Manuafacture Execution System (MES) to analysis data.

Tthis method only can control lot to lot monitor. If the equipment (EQP) is instable, then processed wafer must do a remedy. For example, rework process. Thus, it increase manufactures cost, decrease equipment efficiency, and delayed delivery. So bring the Advanced Process Control [1](APC). All method of work, it set up one device in commnunication line between equipment and EAP, to collect data that APC needed. But this method let EAP and equipment communication be instable and then effect to FAB automation process.

In this paper, I will use Microsoft Visual Basic 6.0 to devlop program in Microsoft Windowns 2000 platform. I will plug-in software component in original EAP. In addition to improve connection stable, commit APC requirements and support real-time monitor data.

並列關鍵字

EAP ； APC ； Real-time monitor

參考文獻

[1] Tony Mullins, “Advaced Process Control Framework Initiative ( APCFI ) 1.0 Specifications,” SEMATECH Inc., 1997.

[2] V.A. Ames, Jerry Gililland, John Konopka, Rich Schnabl, “Semicondutor Manufacturing Productivity Overall Equipment Effectiveness (OEE) Guide book Revision 1.0,” SEMATECH Inc., 1995.

[3] “Standard for SEMI Equipment Communication Standard Message Service,” Global Information and Control Committee, SEMI E13, 1999.

[4] “SEMI Equipment Communication Standard 1 Message Transfer,” Global Information and Control Committee, SEMI E4-0699, 1999.

[5] “SEMI Equipment Communication Standard 2 Message Content,” Global Information and Control Committee, SEMI E5-0299, 1998.