晶圓研磨與切割製程之優化研究

Study of Wafer Backside Grinding and Sawing Process Optimization

簡嘉宏(Chia-Hung Chien)

指導教授 ： 范治民

元智大學/工程學院/工業工程與管理學系/碩士(2012年)

https://doi.org/10.6838/YZU.2012.00207

摘要

本研究目的為透過實驗之優化研究，進而提升晶圓研磨與切割製程產品良率，製程能力與生產效率。以中央合成設計(Central Composite Designs)為基礎。
在晶圓研磨製程實驗當中，所考慮之參數包含研磨輪轉速、第一段進刀速、研磨輪第二段進刀速，在晶圓研磨第一階段發現生產效率不佳，缺點為產出過低，因為產能限制，此參數會造成生產力的損失，迫使我們在進刀速度的設定必須要往上調，然而進刀速度若移太大，後果會導致晶圓邊緣破裂提高而造成良率損失，後果可由研磨輪轉速來補償。經由我們調整優化後，提升製程產品良率,製程能力,生產效率 。
在晶圓切割製程實驗當中，所考慮之參數包含切割軸一轉速、切割軸二轉速、切割進刀速、切割深度列為實驗考量的關鍵參數，另外增加介面活性劑(SD-18)用以增加實驗的延伸性。每個反應變數的期望值，崩碎平均值為望小特性、崩碎標準差為望小特性、良率損失為望小特性，經由篩選我們得到，符合我們反應變數的期望值,且達到符合我們生產量指標。
將這兩個製程結果優化後，我們提升了晶圓研磨與切割製程產品良率,製程能力，生產效率，達到了本研究的目的。

關鍵字

中央合成設計 ； 晶圓研磨 ； 晶圓切割

並列摘要

This research conducts sequential experiments with the technique of central composite design to optimize both wafer grinding and cutting processes.
For the wafer grinding process, the challenge is on determining the feed speed. The optimal setting of feed speed determined by earlier experiments achieved high product yield but with the sacrifice of productivity. Through our new experiments and analyses, it is found and validated that a significant decrease of feed speed with the compensation of a higher grinding wheel speed can result in high product yield and high production efficiency at the same time.
For the wafer cutting process, the concerns are on setting the cutting shaft speed, x-axis cutting speed, y-axis cutting speed, cutting feed rate, cutting depth,and surfactants. Experiment optimization results show that all response variables are well controlled on target, product yield is enhanced, and both the amount and size of collapse broken features are greatly reduced.
Our research results successfully lead to the enhancement of product yield, process capability, and production efficiency on both wafer grinding and cutting processes.

並列關鍵字

Central Composite Design ； Wafer Grinding ； Wafer Sawing

參考文獻

8.楊政融(2006).以反應曲面法進行液晶螢幕多重領域最佳設計. 機械工程學系碩博士班,國立成功大學.碩士論文.

2.Montgomery,D.(2008).Design and analysis of experiments, John Wiley & Sons Inc.

英文部分

1.Giovanni,M.(1983)."Response surface methodology and product optimization."Food Technology 12.

中文部分