製備聚甲基丙烯酸甲酯包裹無機導熱材之聚合研究

The study of polymerization for the inorganic thermal conductivity materials encapsulated by poly(methyl methacrylate)

廖火生(Huo-Sheng Liao)

指導教授 ： 許克瀛

中原大學/工學院/化學工程研究所/碩士(2002年)

https://doi.org/10.6840/cycu200200544

摘要

摘　要

本研究以甲基丙烯酸甲酯(MMA)為單體，聚乙烯醇(PVA)為穩定劑，於分散媒介中加入導熱無機材－氮化硼(Boron nitride)，進行懸浮聚合反應，製備導熱高分子材料。探討反應溫度、攪拌速度、穩定劑濃度等，對導熱無機顆粒包裹率的影響。並比較表面未包覆PMMA之導熱無機材與表面包覆PMMA之導熱無機材和矽橡膠共混、加工成型後之熱傳導性質。
由實驗結果得知，提高聚合反應溫度、起始劑濃度、油水比、氮化硼(Boron nitride)的包裹率卻減小，而增加穩定劑濃度時，氮化硼的包裹率隨之增加。另在本研究中，攪拌速度在500rpm時，氮化硼的包裹率最低。經由實驗所製備的導熱高分子材料與矽橡膠摻混後，其熱傳導係數達1.4w/m. k。

關鍵字

包裹率 ； 懸浮聚合反應 ； 熱傳導係數

並列摘要

Abstract

Suspension polymerization of MMA by using PVA as the stabilizer was carried out to encapsulate Boron Nitride (BN) particle, which is already dispersed in water media. The effect of polymerization parameters, such as polymerization temperature, steric dispersant concentration and the impeller speed on the amount of PMMA in the encapsulated BN and the thermal conductivity of the encapsulated polymer particle was investigated. The thermal conductivity of blends of encapsulated boron nitride and elastomer was also studied.
From the experiment, it is found that the Boron Nitride capsulation decreased when we increased the polymerization temperature、initiator concentration and aqueous phase/organic phase ratio. However, when we increased the steric dispersant concentration, the Boron Nitride capsulation increased consequently. From this study, we also found the Boron Nitride capsulation reached to the minimum level when the stirring speed was 500 rpm. Finally we reached a conclusion that the thermal conductivity was 1.4w/m·k when we use a blending which was prepared from the thermal conductive polymeric material got from this experiment and silicon rubber.

並列關鍵字

Suspension polymerization ； capsulation ； thermal

參考文獻

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