奈米黏土應用於環氧基材之高功能材料開發

Study for The High Performance Electronic Packagin Materials Based on Novolac-Clay Nanocomposites.

李志宏(Chih-Hung Li)

指導教授 ： 陳玉惠 ； 蔡宗燕

中原大學/理學院/化學研究所/碩士(2004年)

https://doi.org/10.6840/cycu200400426

摘要

摘要
印刷電路板在電子產品中扮演相當重要的角色，其中以銅箔基板為最主要的產品，而銅箔基板的製作過程是先將樹脂含浸玻纖布後，再以熱壓的方式貼上銅箔，蝕刻留下所需的線路後，依功能需求可製成各式各樣的板材。當銅箔基板應用於家電類電子產品中多屬單面板；在工業、通信及一些較精密的消費性電子產品則為雙層板；在電腦、通訊、自動控制設備甚至是軍事航空所需的為多層板。
當產品越趨於輕、薄、短、小，則銅箔基板本身材料的特性對於尺寸安定性、耐熱性與吸水率的要求就愈嚴苛。故本論文研究的目的是希望藉由改質型層狀黏土的添加，利用有機無機奈米混成效應，改善並提升銅箔基板材料之性能，包括降低熱膨脹係數、減少基板吸水率、難燃性質的提升、以及增長過錫爐時爆板所需的時間。
本研究中，首先製備有機改質型蒙脫土，再添加到Novalac系統樹脂中，探討改質劑種類對黏土插層的影響，並反應得到C階段（post cure）的產物。在樣品的檢測上，首先利用XRD測定，了解黏土在Novalac樹脂中的分散情形，再利用熱重分析儀及動態機械分析儀觀察其熱穩定性，探討玻璃轉移溫度（Tg）的變化；並利用飽和壓力鍋測試檢測其吸水率的改善程度1，並以過錫爐的方法測試爆板時間；熱機械分析儀檢測可得熱膨脹係數。同時，以自行合成之難燃劑改質蒙脫土添加於樹脂中，對於基板的難燃性質以限氧指數檢測，可獲得顯著的提升。

關鍵字

奈米複合材料

並列摘要

Abstract
Printed circuit board（PCB）plays an important role in electronic products, and Copper Clad Laminate, called CCL, is one of the major components. CCL made by 3 stages as show blow. Stage A, the glass fiber is coated by epoxy slurry, which contains monomer、initiator、curing agent and solvent. Stage B, the coated glass fiber is cooked until preprag formation. Stage C, the preprag is covered with copper foil and post cured under pressure and degas. After etching copper foil and forming circuit map, the printed circuit board, applied to general electronic products, is made by single-sided CCL. For the application of industrial and communication devices, PCB is made by double-sided CCL. However, multilayer CCL is for the application of personal computer, communication device, automatic control equipment even for military or airplane.
In this study, the applied clay, which intercalated with different types of curing agents, mixed with novalac resin, and prepared the novalac/clay nanocomposites. Therefore, the properties of CCL have been improved in CTE, water uptaken ratio, flame retardant, and thermal stability. These properties were identified by the analysis of TGA、DMA、DSC、PCT and LOI.

並列關鍵字

Nanocomposites

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