摘 要 近幾年來,半導體產業不斷蓬勃發展,產業間相互的競爭也越來越激烈,而要在激烈的競爭中脫穎而出,一方面不僅要提高產品的生產技術、品質與可靠度,另一方面的關鍵即在於成本(Cost),而本研究之目的就是期望得到兼顧產品可靠度與預燒測試成本的最適預燒時間。進行預燒之研究,首先必須先瞭解產品的壽命是符合何種統計分配,本研究是透過壽命試驗資料的適合度檢定,驗證出產品壽命之適切統計分配。其次則是要決定預燒時間為何,本研究分別探討在一般模式下的預定可靠度目標模式和成本最小化模式,以及在Burn-In error 模式下之預定可靠度目標模式和成本最小化模式,之後再分別執行各個模式之敏感度分析,並參考敏感度分析結果,以決定最適預燒時間為何。
Abstract Recently, the semiconductor industrial markets are expanding rapidly. To survive on the competive markets, one must enhance the manufacturing technology and improve the quality and reliability. Cost issue must be considered as well. The purpose of this study is to generate an optimal Burn-In strategy that can meet the reliability requirement and minimizes the Burn-In cost. The first issue of Burn-In study is “What is the product life time statistical distribution type”. This study performs the goodness of fit test and base on goodness of fit test result confirms to the statistical distribution assumption. The other issue is how to determine the Burn-In time. This study considers the “Reliability Objective Model” and “Minimize Cost Model”under general condition and Burn-In error condition. Finally, sensitive analysis is done to alalyze the optimal Burn-In time.