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  • 學位論文

蝠翼:一個晶圓圖特徵化與產生的歸納模型

Bat-Wing: An Inductive Model for Wafer Map Characterization and Generation

指導教授 : 陳竹一
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摘要


在製程變動的情況,晶片的良率會因為在晶圓上不同的位置下,會有不同的特徵。這些因製程而導致良率變化的特色,從晶圓圖的觀點來觀察是最容易了解的。在這篇論文中,我們從收集到的資料中歸納出晶圓圖會有以蝠翼良率的變化特色,然後將這變化的特色加入了空間相關性,最後提出一個具有空間相關性晶圓圖產生器並且是可以產生群聚的現象,同時也建構出一個快速分析群聚現象位置和大小的方法。

並列摘要


Under the process variation, the yield of the chips which are at the different locations with different characterization is in the same wafer. Because of the characterization of the yield of the process variation, it is the easiest observation from the viewpoint of the wafer-map. In this paper, we suggest a wafer map generator with the special correlation which is based on the characterization of the bat-wing yield. The wafer map generator can produce the cluster phenomenon, and the rapid method has been established to judge the position and size of the cluster.

參考文獻


[1] M. Orshansky, L. Milor, P. Chen, K. Keutzer, and C. Hu, “Impact of spatial intrachip gate length variability on the performance of high-speed digital circuits,” in IEEE Trans. on Computer-Aid Design of Integrated Circuits and Systems, May, 2002, pp.544-553.
[3] W. Maly, H.T. Heineken, J. Khare, P.K. Nag, P.Simon and C. Ouyang. ”Design-Manufacturing Interface: Part II – Applications,” proceedings of DATE, Feb 1998, pp. 557-562
[4] Hiroo Masuda, “Challenge: variability characterization and modeling for 65- to 90-nm processes,” IEEE custom integrated circuits conference 2005.
[7] W. Maly, H.T. Heineken, J. Khare, and P.K. Nag, ” Design -Manufacturing Interface: Part I – Vision,” proceedings of DATE, Feb 1998, pp. 550-556.
[9] J. Cain and C. Spanos, “Electrical linewidth metrology for systematic CD variation characterization and causal analysis,” Metrologe, Inspection, and process Control for Microlithography XVII, Proceedings of SPIE vol. 5038, 2003, pp.350-361.

被引用紀錄


廖仁男(2010)。迴力棒等效性:均勻分佈晶圓圖之分類器〔碩士論文,國立中央大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0031-1903201314405973
林正田(2012)。就隨機瑕疵源角度之晶圓圖分析〔碩士論文,國立中央大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0031-1903201314432501

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