在現代積體電路封裝製程中,如何提升生產技術與良率,並降低生產過程中所產生的異常損失,是每個半導體廠一直追求的目標。在封裝製程中,電鍍站主要將導線架底材上鍍上一層錫或錫合金,以避免底材氧化及利於IC後續在表面著裝技術上有幫助其銲性的特性,因此,假如鍍層不足,會導致後製程組裝過程中造成可靠度的問題。 因此,本研究結合多種領域知識,如法拉第定律、模糊理論、GUI介面開發,建構一套模糊參數調控系統,首先實驗數據取變化量,利用Matlab Fuzzy模組進行衡量,以求得最適解作為比較的基準,並且藉由面積對電流及鋼帶速度之操縱變化設立數學模型,也建立模糊規則庫,以減少推論過程繁雜及時間過長之問題,接著再透過GUI介面開發,以省去使用者因不了解程式及圖控系統操作所帶來之複雜性,最後建構一套完整的模糊參數調控系統,經過驗證後,準確率達99.82%。未來期望此系統能幫助操作人員快速找出較佳的製程參數組合,以減少製程參數調控的時間與降低原物料的成本,並提高產品的品質。
For modern IC assembly, it is always a chasing goal to upgrade technique and decrease process loss. Plating mainly tins a layer of Sn or Sn alloy on Lead Frame to prevent oxidation and for good soldering of SMT (Surface Mount Technology), but, insufficient plating thickness will lead to Reliability problem of PCBA (PC Board Assembly). Therefore, this research is to integrate Faraday law of electromagnetic induction, Fuzzy Logic and GUI (Graphics User Interface) to construct a Fuzzy Theory of Process Parameter Setting by means of using Matlab Fuzzy module to examine variation of experiment data to have proper solution as the criterion, and build math module from the change of belt speed and plating rectifier current. The setting of fuzzy rule base can decrease compute process and simplify the complexity from equation and Graphic Monitoring Control Systems through GUI, its accuracy can reach 99.82% after verification. It not only will help to recognize optimal parameters quickly to save time, but decrease material cost, furthermore, to improve product quality.