本研究主要目標是利用微機電系統技術結合生醫材料來設計製作扇形擴散晶圓級可撓性封裝,並使用有限元素軟體ANSYS來進行可靠度測試,其重點在於溫度循環測試。由於構裝元件是由各種材料所組成,在經歷溫度負載測試階段,由於熱膨脹係數的不匹配,產生熱應力及熱應變,而使構裝元件壽命大幅的減短。本研究透過熱疲勞模式來預測封裝結構的壽命。 本研究也將模擬後的模型進行實體製作,將扇形擴散晶片封裝於可撓性基板PDMS中,搭配印刷電路技術將特蝶設計的馬蹄型電路配置在其中,並探討印刷於不同材料之基板上的效果,經由特別設計的彎曲測試機台來測試可撓性封裝的電路導通之狀況,以分析結構體的可彎曲狀況,完成防水又具可撓性的封裝結構體。
The purpose of this research is to design and fabricate the fan-out wafer level flexible package by micro-electro-mechanic system (MEMS) technology with biomaterial. Reliability of temperature cycling test has been conducted through the commercial finite element analysis software ANSYS. Thermal loading test are crucial for multiple materials constructed in packaging structure. Due to mismatch of thermal expansion coefficients, thermal induced stress/strain would result in a decrease in the life of electronic packages. Therefore, the predicted life can be determined through previous developed thermal fatigue models. Beside the computer predictions, physical component and device based on simulation model are fabricated. Fan-out wafer level chip is embedded in a flexible PDMS substrate and a special designed horse’s hoof circuit pattern is screen printed in thin film. Parametric studies are performed for different patterns on different thin film materials. In addition, the maximum curvature of package is achieved through bending test in a special designed fixture. The final product is flexible and moisture resistant.
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