Analysis of Thermal Resistance Structure of Single-Chip LEDs Using Transient Thermal Resistance Measurement Method

以暫態熱阻量測法分析單晶片LEDs之熱阻結構

趙珍誼(Chen-I Chao) ； 林唯耕(Wei-Keng Lin) ； 王本誠(Paul H. Wang) ； 陳紹文(Shao-Wen Chen) ； 王鴻博(Pen-Cheng Wang) ； 簡國祥(Kuo-Hsiang Chien)

《中國機械工程學刊》 34卷6期 (2013/12) Pp. 527-537

摘要

本研究以暫態熱阻量測法為理論基礎建立LED之熱阻量測系統，並運用本實驗設計開發之暫態熱阻分析軟體，對其內部結構進行分析，建立出LED整體熱阻結構。將其與理論值做比較分析，發現其誤差值皆控制在10%以內，且量測結果之重複性極高，此套方法可做為LED設計改進的基礎，未來對於LED的封裝材料選擇時，提供更多重要的參考資訊。

並列摘要

The study used the theoretical basis of the transient thermal resistance measurement method to establish an LED thermal resistance measurement system. The Transient Thermal Resistance Structure Analysis (TTRS Analysis) software designed and developed for this study was used to analyze its internal structure in order to establish the overall thermal resistance structure of the LED. When comparing the results to the theoretical value, it was found that the error values were kept to within 10%, indicating extremely high repeatability of the measurement results.

並列關鍵字

light-emitting diodes ； junction temperature ； thermal resistance structure