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The Study of Electro-Formed Copper on Micro Deep Drawing Process

電解銅箔於微引伸成形之研究

摘要


近年來,微成形之研究不論在理論的解析或是在微機械性質的討論已越來越受到重視。已知傳統的數值分析已不再適用於微成形領域,本研究利用作者自行開發之有限元素分析程式進行電解銅箔於微引伸製程之探討。透過實驗與模擬的結果可證明,此程式可精準的預測材料於微引伸過程之變形。

關鍵字

無資料

並列摘要


For the last ten years, there has been a significant research interest in metal micro forming. However, neither a methodology nor exact micro mechanical properties have been properly determined. Traditional numerical programs are of little use in analyzing cases on micro scale. This study demonstrated the simulation precision and estimated the feasibility of electrodeposited copper on micro deep drawing process. The analysis program was created by the authors. Based on comparisons between experiment and simulation, an analytical limit and a feasibility of electrodeposited copper on micro deep drawing process were found. To find the analytical precision of this program for micro-scale numerical analysis, the study compares all experimental results and simulation results. The electrodeposited copper was chosen as the experimental material. As the comparison between experiment and simulation, the analytical precision of this program was determined and the feasibility of electrodeposited copper had been found on micro deep drawing process.

並列關鍵字

micro deep drawing FEA electro-formed copper

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