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  • 學位論文

無電解電鍍銅鎳所使用的錫鈀藥水的研發與成份分析

The Development and Constituents Analysis of Tin Palladium Solution used in Electroless Copper Nickel Plating

指導教授 : 許世興
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摘要


無電解電鍍又稱之為化學鍍或自身催化電鍍,無電鍍是指於水溶液中之金屬離子在控制環境下,予以化學還原。 以一般常用聚酯纖維布經過前置處理後施以電鍍金屬鍍層使其具有金屬特性而成為導電纖維布可分為:鍍銅鎳導電布,鍍金導電布,鍍碳導電布,鋁箔纖維複合布。外觀上有平紋和網格區分,電導布可用於從事電子、電磁等高輻射工作的專業屏蔽工作服,屏蔽室專用屏蔽布,IT行業屏蔽件專用布,當下流行觸屏手套,防輻射窗簾等。 錫鈀藥水通常是無電電鍍的催化劑,主要由氯化亞錫及氯化鈀進行氧化還原形成鈀粒子,可分為酸基膠體鈀及鹽基膠體鈀,鹽基膠體鈀以氯化鈉取代易揮發的鹽酸,可以防止酸氣的產生並且提昇錫鈀藥水的安定性。 使用氫氧化鈉滴定錫鈀藥水得知鹽酸溶劑約為8 M,ICP-OES檢測與碘滴定結果33 %氯化亞錫、1 %氯化鈀及7 %錫酸鈉;錫鈀藥水中為了避免亞錫離子被空氣氧化,而破壞了錫鈀藥水,必須添加安定劑,本實驗以UV、GC、NMR及IR鑑定出廠商藥水中安定劑為間苯二酚,定量結果為5 %。 錫鈀藥水生產共分為一步加入法、二步加入法以及三步加入法,本實驗採用較安定的三步加入法,經過熟化溫度及時間的控制後,生產出的錫鈀藥水皆有良好的安定性,進行錫鈀藥水銅鎳電鍍試驗時,所電鍍出來的電導布電阻維持在0.03-0.05之間及密著性試驗也維持在4-5級,符合廠商規格。

並列摘要


Electroless plating is also called chemical plating or autocatalytic plating. Electroless plating means that metal ions in an aqueous solution are chemically reduced in a controlled environment. Commonly used polyester cloth after pre-treatment applied to the metal plating layer to make it a metal conductive fiber cloth can be divided into: copper-nickel conductive cloth, gold-plated conductive cloth, conductive carbon cloth and aluminum foil fiber composite cloth. The appearance of conductive cloth with plain and grid distinction can be used to engage in electronic/electromagnetic radiation shielding functional cloth, room dedicated shielding cloth, IT industry shielding special cloth, current popular touch screen gloves and radiation curtains etc. The tin palladium solution is usually electroless plating catalyst, mainly by the redox reaction through stannous chloride and palladium chloride to form palladium particle that can be divided into acid-based colloidal palladium and salt-based colloidal palladium. The salt-based colloidal palladium with sodium chloride to replace easily volatile hydrochloric acid can prevent the production of acid gas and improve the stability of tin palladium solution. The tin palladium solution of the cooperative enterprise contains about 8 M hydrochloric acid that concentration was titrated with sodium hydroxide, 1% palladium chloride, 33% stannous chloride and 7% sodium stannate analyzed by ICP-OES and iodine titration. In order to avoid the air oxidizing the stannous ions in tin palladium solution and destroy the tin palladium colloid, it is necessary to add stabilizers in the colloid solution. The stabilizer is identified as resorcinol and quantified about 5% with UV, GC, NMR and IR etc. instruments. The production of tin palladium solution is usually classified into one-step addition, two-step addition and three-step addition methods. This experiment uses the three-step addition method which can achieve the more stable resulting solution, after aging with suitable temperature and proper time control, the produced tin palladium solution has good stability. After carrying on the copper-nickel electroplating test, the conductivity of cloth maintains the resistance between 0.03-0.05 and the adhesion test maintains at 4-5 level, conforming to the specifications of the cooperative enterprise.

參考文獻


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