- 期刊
Numerical Study of Thermal Performance of FC-PBGA Assembly with Extruded-fin Heatsink
裝配凸片型散熱器的覆晶塑封球柵陣列封裝體的熱性能數值分析
摘要
由於封裝體朝向高電子性能，高I/O數，微小型化，所以強化散熱性能一直是很重要課題。本文使用ANSYS商用軟體，建構詳細的有限單位元素網格，在熱對流及熱輻射環境下，針對覆晶塑封球柵陣列（Flip-Chip Ball Grid Array， FC-PBGA）封裝體裝配不同散熱器進行精密的熱傳數值模擬分析，求解封裝體內溫度分佈。並進一步，比較它們的散熱性能。使用的網格含蓋熱通孔、錫球、墊片、散熱銅層、防護罩、散熱器、印刷電路板等重要元件，使得網格更能接近實際封裝體，使得模擬結果更準確。最後，針對影響覆晶塑封球柵陣列封裝體（裝配凸片型散熱器）散熱性能的各種變數（凸片長度、凸片厚度、凸片數目、支撐架厚度、凸片導熱係數度與風速等因子）進行靈敏度分析。
關鍵字
無資料並列摘要
The trend in microelectronics is toward increasingly higher input/output, higher component density and higher electrical performance, which makes thermal enhancement of package performance an increasingly important issue. In both natural and forced convection environments, three-dimensional finite element simulation is used to study thermal performance of a flip-chip plastic ball grid array (FCPBGA) assembly with an extruded-fin heatsink on top of the assembly. The finite element model is complete enough to include key elements such as bumps, solder balls, substrate, printed circuit board, vias and ground planes for both signal and power. Temperature fields are simulated and presented for several FC-PBGA assembly configurations. Thermal resistance is calculated to characterize and compare the thermal performance by considering alternative design parameters of the extruded-fin heatsink and the lid.