銅基材鍍鎳在鹽水中耐蝕性之研究

Corrosion Resistance of Nickel-Plated Copper in NaCl Aqueous Solution

楊齡慧(L. H. Yang) ； 周孟鋒(M. F. Jou) ； 楊聰仁(T. J. Yang)

《材料科學與工程》 35卷3期 (2003/09) Pp. 193-198

摘要

在銅片上無電鍍不同磷含量的鎳磷鍍層或電鍍純鎳層，於3.5% NaCl水溶液中的電化學分析、浸漬試驗皆顯示有較佳的耐蝕性；鎳鍍層經過800℃熱處理3小時後，由電子顯微鏡、XRD分析可證明銅鎳合金擴散層的存在，而無電鍍鎳的鎳及鎳磷析出物(Ni3P)容易誘發伽凡尼腐蝕，造成鍍層整體抗蝕性下降，依據光學顯微鏡觀察，鍍層晶界有加速腐蝕的現象，試片熱處理前之耐蝕性與鍍層磷含量有關，磷含量高時耐蝕性佳；熱處理後，磷含量低且鎳銅擴散層深度較大之試片有良好之耐蝕性。

關鍵字

無電鍍 ； 鎳磷鍍層 ； 銅鎳合金擴散層 ； 耐蝕性

並列摘要

Copper plated with nickel by electroplating or electroless plating shows better corrosion resistance in 3.5% NaCl aqueous solution, based upon electrochemical analytical and dipping test results. Copper-nickel alloy diffusion layer was identified by SEM, XRD for nickel-plated copper panel heat-treated at 800℃ for 3 hours under Ar atmosphere. Galvanic corrosion is easily induced due to precipitation of Ni and Ni3P throughout the electroless nickel coating after heat treatment. The overall corrosion resistance of electroless coating layer and diffusion layer is decreased. Intergranular corrosion was also observed in this sample by optical microscope observation. The corrosion resistance of as-deposited coating layer was related closely to the amount of the phosphorus. The higher phosphorus content, the better corrosion resistance. However, the thickness of copper-nickel diffusion layer is larger after heat treatment as nickel coating with lower phosphorus content, and leads to better corrosion resistance ability.

並列關鍵字

Electroless plating ； Nickel-phosphorus deposits ； Copper-nickel diffusion layer ； Corrosion resistance