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微多孔結構聚醯亞胺薄膜成型方式與探討

Discussion the Forming Method of Microporous Polyimide Film

摘要


聚醯亞胺一直是高性能高分子材料的首選,具有絕佳的熱安定性及良好的機械性質,本研究透過交聯反應,即可在低固含量(20wt%) 下塗佈出具一定強度並含高孔隙率之聚醯亞胺薄膜,透過NIPS(Nonsolvent Induced Phase Separation) 法使薄膜在成型過程形成孔洞,多孔結構薄膜可增加其保溫功能,並探討不同成型條件下的孔洞結構保溫的效果,發現在5°C水下成型之聚醯亞胺薄膜於不同溫度下(80°C、100°C、120°C、140°C) 做的保溫測試,其保溫效果皆為最佳。

並列摘要


Polyimide has always been the first choice for high performance polymer materials, with excellent thermal stability and good mechanical properties. In this study, we can made a polyimide film with strength and high porosity by cross-linking reaction which in low content (20 wt%) polyimide. The film is formed during the molding process by NIPS (Nonsolvent Induced Phase Separation) method, porous structural can increase the insulating function.And we find out that the polyimide film which forming under 5°C water has the best insulation effect even in different testing temperatures (80°C、100°C、120°C、140°C).

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