- 期刊
應用實驗設計法於半導體導線架電鍍製程最佳化之研究
Application of Design of Experiments in Optimization of Semiconductor Lead Frame Electroplating Process
摘要
臺灣在全球半導體的供應鏈當中，具有相當重要的地位，主要的原因除了產業群落效應及上下游之間的整合之外，成本的管控更是企業能否獲利並永續經營的重要指標。而在製造業中，原物料及人力成本為支出比例最高之項目，尤其在半導體導線架的電鍍製程，因高度依賴錫原料及人力作業，故如何優化半導體導線架電鍍製程並保持市場競爭力，是本研究最重要的課題及研究目的。在過去的研究中，有關電鍍製程的研究多偏向滾鍍或掛鍍的作業模式，且電鍍元素大多著重在金、銀、銅、鎳等材料，對於半導體導線架的鍍錫製程則鮮少被提及和討論。在本研究之個案工廠中，面臨到的問題是鍍錫製程參數無法在最短時間最佳化，導致薪資及原料成本的上升。因此，本研究透過實驗設計法，找出半導體導線架鍍錫製程參數之最佳設定。研究結果顯示，本研究可將電鍍工程平均實驗次數由改善前的7.69次，降至改善後的2.67次，改善效益為34.72%；而工程實驗的時間則可由原先的11.54小時降至3.22小時，改善之效益為27.90%；另外針對產品的鍍錫厚度，可由改善前的0.519 g降至0.431 g，改善效益為83.04%。整體而言，本研究所提出之方法，可以有效地降低電鍍製程的實驗時間及原料成本，對於整體的製造成本有顯著地改善。
並列摘要
Taiwan holds a crucial position in the worldwide semiconductor supply chain due to its industrial cluster effect and integration between the upstream and downstream of the supply chain. The ability to control costs is a critical factor for companies to achieve sustainable profits. Within the manufacturing industry, expenses related to raw materials and labor costs are the highest, particularly for the electroplating process of semiconductor lead frames, which relies heavily on tin raw materials and labor operations. Therefore, effectively addressing this issue and maintaining market competitiveness is a significant research topic. Existing literature primarily focuses on barrel plating or rack plating operation modes and electroplating elements such as gold, silver, copper, and nickel, with minimal emphasis on improving the electroplating tin process of semiconductor lead frames. The problem faced in this study was that the tin plating process parameters could not be optimized in the shortest time, resulting in an increase in wages and raw material costs. This study employs statistical process control and the design of experiments methodology to identify the optimal process parameter settings. According to the results, our approaches can significantly reduce the number of electroplating engineering experiments from 7.69 times to 2.67 times, resulting in a 34.72% improvement benefit. Additionally, the engineering experiment time can be reduced from 11.54 hours to 3.22 hours, resulting in a 27.90% improvement benefit. Moreover, the proposed methods can reduce the tin plating thickness of the product from 0.519 g to 0.431 g, with an improvement benefit of 83.04%. Overall, the proposed methods can significantly reduce the manufacturing cost.