結合MSA與SPC手法建立異常量測系統之處理流程－以印刷電路板為例

在電子產品多功能及複雜化設計之下，電路零件體積及接點距離隨之縮小，傳遞訊號的速度相對提高，因此印刷電路板（printed circuit board, PCB）高速訊號電性特性阻抗的管控也趨於嚴苛。一般公司在執行量測系統分析（measurement system analysis, MSA）時，是依照MSA手冊建議之時機進行評價，未能即時監控量測程序的穩定性。本研究結合MSA與統計製程管制（statistical process control chart）之概念，建立一個量測設備日常管理和監控之程序。同時，本研究也建立一個量測設備之管制外行動方案（out-of-control action plan, OCAP）的程序，協助查找異常原因並進行改善。另外，針對未達MSA允許範圍之量測設備，提出後續之處理方式。本研究利用PCB電性特性阻抗實際量測值來驗證方法之有效性。研究結果顯示，本研究所提出之方法可以作為日常量測作業管理，並能有效偵測出量測設備異常之情況。同時，本研究建立異常量測系統OCAP流程圖，並依據此流程圖展開設備異常檢核表，經由此表之步驟、檢核內容及檢核之方法，可以快速地找出設備異常來源並排除，防止相同事件再發生，可作為日常設備及量測作業管理之參考。

關鍵字

量測系統分析；統計製程管制；管制外行動方案

並列摘要

With the multi-functional and complex design of electronic products, the volume of circuit components and the distance between contacts have been reduced, leading to an increase in the transmission speed of signals. Consequently, strict control over the high-speed signals' electrical characteristics impedance on circuit boards is required. Many companies evaluate their measurement systems based on the recommendations in the measurement system analysis (MSA) manual, without real-time monitoring of the measurement process's stability. This study combined the concepts of MSA and statistical process control charts to establish a procedure for the daily management and monitoring of measurement equipment. Additionally, an out-of-control action plan (OCAP) procedure was developed to assist in identifying abnormal causes and implementing improvements. Furthermore, the study proposed subsequent actions for measurement equipment that does not meet the acceptable MSA criteria. This study utilized the actual impedance data from printed circuit board to validate the effectiveness of the proposed methods. The results indicate that the proposed approach can be utilized for daily operation management and effectively detect abnormal conditions in measurement equipment. The OCAP process introduced in this study is also efficient in identifying the reasons for abnormalities.