There are more and more electric consumer products be used now, and there are more and more competitions among enterprises. People want to buy the products of higher quality with lower price; it's the same as manufacturers who want to improve the process create lower cost and keep the price competitive. In this paper, we studied the optimal conditions for Chips Cleaning Process by Using Taguchi Accumulation Analysis in the CMOS (Complementary Metal-oxide Semiconductor) image sensor assembly process and reduced the particles remain on the chip surface after Cleaning Process. We found out the major effect factors in the cleaning machines by the experiments with L9(3^4) Orthogonal Array and Taguchi Accumulation analysis. Finally, we got high quality effect cleaning conditions and then the cleaning factors were verified by experiments. The experiments identified that the cleaning factors can provide better IC assembly yield.