並列摘要
This research presents a more efficient solution for PCB copper pour coverage. By shortening the travel path and reducing overlap areas, a strategy is designed for effectively covering triangles and certain quadrilaterals. The overlap rate remains significantly lower than that of current methods. Compared to traditional approaches and previous improvements, this coverage strategy greatly reduces time and material costs, enhances production efficiency, and ensures a more uniform coverage, thereby improving the reliability of large copper areas.