- 期刊
半導體產業化學機械研磨墊材料技術服務滿意度分析
Semiconductor industry in chemical mechanical polishing pad material's technical service satisfaction analysis
摘要
自1997年開始，半導體製程邁進0.5微米元件線寬以下，幾乎所有半導體製造廠便開始採用化學機械研磨技術（Chemical Mechanical Polishing, CMP）來取代乾蝕刻製程。因此與化學機械研磨相關之材料也越趨重要，而化學機械研磨墊材料便是其中一項。運用SERVQUAL理論分析找出服務品質5大構面，對於半導體產業之問卷並運用SPSS對於問題、提昇服務品質及顧客滿意度的診斷之方法，來分析能否符合半導體產業業者所期待之研究。本研究利用SERVQUAL理論，進而建構出半導體產業化學機械研磨墊材料技術服務品質衡量問卷，再利用SPSS找出顧客滿意度。最後，利用深度訪談了解其顧客滿意度，以作為相關化學機械研磨墊材料業者經營策略的參考。
並列摘要
Since 1997, the semiconductor process into line width below down to 0.5 micron. Almost all semiconductor manufacturers began using chemical mechanical polishing technology (Chemical Mechanical Polishing, CMP) to replace the Dry etching process. Therefore, related material and chemical mechanical polishing is also becoming more important, and polishing pad is one of them. Using SERVQUAL identify five dimensions of service quality for the Semiconductor industry in chemical mechanical polishing pad material's vendor and to use of questionnaires. Using SPSS for complex problems、improve service quality and customer satisfaction diagnosis method. To analyze reseach is can meet semiconductor industry's expect. In this study. Useing SERVQUAL theory, and then construct the semiconductor industry chemical mechanical polishing pad material technical service's questionnaire to measure quality of service. And then use SPSS to find out customer satisfaction. Finally, use in-depth interviews to understand customer's satisfaction. Then provide it for chemical mechanical polishing pad material industry's vendor business strategy reference.