- 期刊
以實驗設計法評估錫-3.0銀-0.5銅無鉛銲料與錫-37鉛銲料與Au/Ni/Cu金屬層銲點性質之研究
Evaluation of Solder-Joint Properties of the Sn-3.0Ag-0.5Cu and Sn-37Pb Solders with Au/Ni/Cu as Under Bump Metallurgy by Using the Design of Experiment Method
摘要
錫-3.0銀-0.5銅與錫-37鉛共晶為目前最普遍使用之銲料，Au/Ni/Cu金屬層為常用的底層金屬材料（UBM）。本研究利用手工銲接製程，並配合實驗設計法（DOE）原理，利用直交表配置排列方式進行實驗，評估影響銲點結合強度之實驗因子。並量測銲接製程中阻抗值差異變化，進一步探討錫-銀-銅與錫-鉛銲料在混和使用時銲點結合強度變化，以求得手工銲接製程之最佳操作條件。實驗結果顯示：烙鐵溫度、銲接時間、墊層尺寸、加熱板加熱時間均為影響接合強度之實驗因子，其中以烙鐵溫度為最主要之因子。而量測各系統銲點中的阻抗值變化，其結果無明顯差異。原因可能為所生成之介金屬相厚度皆很薄，不足以影響到整體阻抗值變化。建議延長測試時間，以找出真正影響銲接品質之因子。
並列摘要
The eutectic Sn-37Pb and Sn-Ag-Cu solders are widely used in electronic packaging processes, and the multi-layer structure Au/Ni/Cu has been utilized in the under bump metallization (UBM) or the bond pad for the printed circuit board (PCB). In this study, design of experiment (DOE) is used for a hand soldering process to find significant factors which influence mechanical strength of solder joints. Meanwhile, obtaining optimum operation conditions to make sure the reliability of solder joints in good quality is necessary. Further, the resistance variation of joint was measured. Experimental results indicate that significant factors are soldering iron temperature, soldering time, heat plate heating time and pad size in hand soldering rework processes. Due to intermetallic compounds grown weakly, the variation of resistances is unapparent. In addition, the microstructure of the solder joint has voids for lead-free and lead solders used collectively. This may reduce the joint mechanical strength.