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PMMA板材某些特定性質之研究
Study on the Some Specified Properties of PMMA Sheet
摘要
本研究主要針對2 mm厚度之聚甲基丙烯酸甲酯（PMMA）板材，在50℃至160℃溫度下進行某些特定機械性質與流變性質試驗。其中包括PMMA板材在各種溫度下的壓縮應力－應變試驗、應力鬆弛試驗和潛變試驗，並完成比熱和熱傳導係數量測，以及建立動態機械分析（DMA）模數曲線。由不同負荷壓縮試驗條件下所得之應力－應變曲線中，可發現其彈性模數（elastic modulus）皆隨著溫度增加而隨之降低；當溫度高於140℃，其材料彈性模數隨著溫度增加而降低的趨勢更為明顯。從DMA試驗中，可得到PMMA的玻璃轉移溫度Tg點約為102℃，並由內部摩擦tan δ在140℃時略大於1且趨於穩定的趨勢來看，可推論140℃為PMMA材料合適的壓印溫度。另從DSC方法與使用HOT DISK TPS2500分別測量得PMMA在120℃至150℃之間的比熱值約為2J/g℃，而熱傳導係數則為0.3858W/mK（25℃），二者皆可提供日後有關質傳的研究參考。透過本研究有系統對PMMA板材之成果，必能對學術界在材料試驗方面與成型技術上的模擬分析有所助益，並且對生產業者在相關產品技術開發方面也有非常大的貢獻。
並列摘要
In this study, some specified mechanical and rheological properties of PMMA sheet with 2 mm thickness under the temperature range of 50~160°C were conducted via the experiment of compression, stress relaxation, and creep tests. The specific heat, thermal conductivity coefficient and dynamic mechanical modulus were also measured and established. Based on the measured results, it was found that the compression elastic modulus, which decreases with increasing test temperature, especially decreases significantly when temperature higher than 140°C. From the DMA test, the glass transition temperature is approximately 102°C. Meanwhile, from the result of internal friction tan δ slightly higher than 1, and have the tendency of stable, can conclude that 140°C is the suitable imprint temperature for PMMA material. Alternatively, the values of specific heat and thermal conductivity coefficient were 2 J/g°C (in the range of 120~150°C) and 0.3858 W/mK (25°C), it can provided the investigation of mass transfer in the future. Through the systematic research of various properties for the PMMA sheet, it can beneficial to the simulation and molded guideline of the hot embossing technology for the academia and the manufactures.