Effects of Cu Feedstock on Intermetallic Compound Formation in Cold Sprayed Cu-Sn Coatings

K. H. Ko ； H. Lee ； J. O. Choi

《International Journal of Material Science》 3卷2期 (2013/06) Pp. 45-53

並列摘要

Cu-Sn composite coatings were deposited using various Cu feedstock powders with different sizes and shapes, and the formation of intermetallic compounds (IMCs) in the coatings was investigated. IMC formation by post-annealing of composite coatings could be affected. In addition, when Cu- Sn composite particles were employed, not only the Cu-Sn composites but also Cu-Sn IMCs (Cu_6Sn_5 and Cu_3Sn) were observed at the interfaces between Cu and Sn particles in the as-sprayed state. In the case of the annealed Cu-Sn coatings, the Cu_6Sn_5 formed in the as-coated coatings was transformed into the Cu_3Sn phase, and the embedded Sn particles were fully changed into the Cu_3Sn phase. However, the intermetallic compound formation of Cu_3Sn was different, depending on the shape and size of the Cu feedstock. Therefore, the deposition of Cu-Sn composite coatings using different Cu particles could have an influence on the formation of IMCs.

並列關鍵字

Cold Spray ； Cu-Sn ； Composites ； Intermetallic ； Coatings