Low Temperature Thermal Analysis of TC410 Resin Prepreg and Laminate System

Arpana Prasad ； D. Raghavendra Kumar ； V. Ramakrishnan

《Frontiers in Aerospace Engineering》 2卷1期 (2013/02) Pp. 60-66

並列摘要

TC410 resin prepreg is an advanced engineering material, one of the composite materials used in the fabrication of structural panels for satellites. The low temperature thermal analysis performed by using Differential Scanning Calorimetry (DSC) and Modulated DSC (MDSC) has revealed that the material exhibits reversing glass transition around -50℃ and non reversing endothermic relaxation between -35℃ to -65℃ range. The dip at 0℃ indicates water traces which might be due to moisture content on the surface. The study brings out that the system is thermally stable. All the results are found to be repeatable and reproducible within 3% uncertainty.

並列關鍵字

Prepreg ； Laminate ； TC410 ； DSC ； MDSC ； Glass Transition ； Thermal Analysis