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臺灣半導體設備進軍全球之機會與挑戰術

Taiwan's Opportunities and Challenges in Semiconductor Equipment Globalization

摘要


臺灣半導體製造產能全球第一(全球占比22%)、晶圓代工產能全球第一(67%)、10奈米以下半導體產能全球第一(92%)、封測產能全球第一(55%)、OSAT產能全球第一(33%),趨動臺灣對半導體設備的需求,多年來穩居全球半導體設備市場前三名。然而現今我國設備主要仰賴進口,國產設備占比僅約一成,先進製造設備更小於5%。受地緣政治、半導體供應鏈重組影響,我國設備業將面臨更激烈的競爭環境,因此除了加速技術自主之外,本文將探討國產設備商,如何敏捷地因應全球半導體產業地緣政治、智慧製造、綠色製造等議題,將有助於我國半導體設備商掌握機會、面對挑戰。

並列摘要


Taiwan holds the world No. 1 place in several fields such as: the semiconductor manufacturing capacity (22% of the world's share); the foundry capacity (67%); the semiconductor production capacity below 10nm (92%); the packaging and capacity (55%); and the Outsourced Semiconductor Assembly and Test (OSAT) capacity (33%). These outstanding manufacturing capacities boost Taiwan's demand of semiconductor equipment to be the top three in the global semiconductor equipment market for many years. However, currently the main semiconductor equipment in Taiwan still relies on foreign importation. The local equipment market share is only about 10%, and the advanced manufacturing equipment is even less than 5%. In the future, the trends of geopolitics and the reorganization of semiconductor supply chain will make Taiwan's equipment manufacturers face more competitors. Therefore, besides to accelerating technological research, this article will explore how Taiwan's equipment vendors can quickly respond to the issues of global semiconductor industry geopolitics, smart manufacturing, and green manufacturing. These discussions will help Taiwan's semiconductor equipment manufacturers grasp opportunities and face challenges.

參考文獻


陳子昂,“ 台美半導體產業發展趨勢、策略聯盟和投資機會 ”,臺美半導體產業高峰論壇,2021 年 9 月 2 日
“SEMI:2022 年全球晶圓廠設備支出預估可望創近千億美元新高 ”,SEMI,2021 年 9 月 15日
“SEMI:半導體設備支出將在2022年達到1,000億美元歷史新高 ”,SEMI,2021 年 7 月 14 日
“Strengthening the global semiconductor supply chain in an uncertain era,” BCG X SIA, 2021.
“ 美國晶圓製造商泛林集團將投資 2.25 億美元,在馬來西亞檳城州峇都加灣工業園區設廠 ”,臺灣經貿網,2020 年 2 月 11 日

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