半導體真空泵餘命分析技術

Semiconductor Vacuum Pump Remaining Useful Life

許銘翔 ； 吳鴻材 ； 王俊傑

《機械工業雜誌》 482期 (2023/05) Pp. 31-38

摘要

在半導體產業中，晶圓製程產生的粉塵經常造成尾氣處理設備效能降低或無預警停機。真空泵為尾氣處理關鍵設備，常因粉塵導致真空腔抽氣效率下降、壓力上升，造成粉塵回灌至前段製程系統影響製程良率，真空腔體內因粉塵堆積造成轉子卡死或腔體磨損，使得真空泵健康狀態監測日趨重要。本文目標為建立真空泵健康狀態指標，進行真空泵剩餘壽命預估，提供直觀且簡單的指標，無需透過專業人員進行解讀即可判斷真空泵目前狀態以及剩餘可運轉時數，藉此降低真空泵提早下機以及無預警跳機所衍生的維運及生產成本。

關鍵字

半導體 ； 真空泵 ； 餘命分析

並列摘要

In the semiconductor industry, the vacuum pump is one of the key equipment for exhaust gas treatment. The particle generated by the wafer process often reduces the efficiency of the exhaust gas treatment equipment or shuts down without warning. As far as the vacuum pump is concerned, the increase in the amount of particle leads to a decrease in the pumping efficiency of the vacuum chamber and increase the pressure. The rise of the particle makes the particle recharge to the front-stage pumping system and affects the process yield. Due to the particle accumulation in the vacuum chamber, the rotor is stuck or the chamber is worn, which makes the condition monitoring of the vacuum pump more and more important. The goal of this article is to establish an indicator of the health status of the vacuum pump and estimate the remaining life of the vacuum pump. It provides an intuitive and simple indicator that can judge the current status of the vacuum pump and the remaining operating hours no need to interpretation by professionals, so as to reduce the premature maintenance of the vacuum pump, and reduce the production costs derived from unplanned and unwarranted trips.

並列關鍵字

Semiconductor ； Vacuum pump ； Remaining useful life analysis

參考文獻

J.Y. Lim, W.S. Cheung, and K.H. Chung, “Nondestructive characteristics evaluation for low vacuum dry pumps in the semi-conductor manufacturing process line,” Key Engineering Materials 270, 2345-2350, 2004.

S. Thanagasundram, Y. Feng, and F.S. Schlindwein, “A case study of auto-regressive modelling and order selection for a dry vacuum pump,” Proceedings of the ICSV12-Twelfth International Congress on Sound and Vibration, 2005.

W. Jiang, et al. “A wavelet cluster-based band-pass filtering and envelope demodulation approach with application to fault diagnosis in a dry vacuum pump,” Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 221, 1279-1286, 2007.

S.W. Butler, J.V. Ringwood, and N. MacGearailt, “Prediction of vacuum pump degradation in semiconductor processing,” IFAC Proceedings Volumes 42(8), 1635-1640, 2009.

S. Thanagasundram and F.S. Schlindwein. “Autoregressive based diagnostics scheme for detection of bearing faults,” Proceedings of ISMA2006 Noise and Vibration Engineering Conference, 2006.