- 期刊
CPO賦能矽光子，開創高速傳輸新紀元
CPO Enables Silicon Photonics: Pioneering a New Era of High-speed Transmission
摘要
鑒於5G、AI及雲端服務的迅速發展，數據流量激增，對網路和記憶體頻寬的需求大幅提升。共封裝光學（Co-Packaged Optics, CPO）技術將光學元件與矽基元件整合在單一封裝基板上，顯著提升傳輸效率並減少延遲，從而應對高頻寬與高能耗的挑戰。本文透過對應用市場的剖析、技術議題的探討以及廠商動態的調查，嘗試描繪CPO技術的發展輪廓。2023年，CPO市場規模為900萬美元，預計到2028年將成長至4,050萬美元，五年間年複合成長率（CAGR）可達35.1%。而資料中心和高性能運算（High-Performance Computing, HPC）領域是主要應用，未來隨著技術落地和大規模量產，CPO市場將持續擴展，驅動未來數據傳輸的革新。本文將深入探討CPO技術在不同應用領域的具體實踐、面臨的技術挑戰及主要廠商的最新動態，提供產業洞見和市場前瞻性分析。
並列摘要
With the rapid development of 5G, AI, and cloud services, data traffic has surged, significantly increasing the demand for network and memory bandwidth. Co-Packaged Optics (CPO) technology, which integrates optical and silicon components on a single package substrate, significantly enhances transmission efficiency and reduces latency, thereby addressing the challenges of high bandwidth and high energy consumption. This article aims to outline the development of CPO technology through market analysis, technical issues exploration, and investigation of industry dynamics. In 2023, the CPO market was valued at $9 million, and it is projected to grow to $40.5 million by 2028, with a compound annual growth rate (CAGR) of 35.1% over five years. The primary applications are in data centers and high-performance computing (HPC) sectors. As technology matures and large-scale production begins, the CPO market is expected to expand continuously, driving innovation in data transmission. This article will delve into the practical applications of CPO technology across different fields, the technical challenges faced, and the latest developments from major companies, providing industry insights and market foresight.