MEMS Sacrificial Layer Release Technology

Xinming lv ； Xinlong Wang

《International Core Journal of Engineering》 9卷12期 (2023/12) Pp. 152-157

https://doi.org/10.6919/ICJE.202312_9(12).0022

摘要

Sacrificial layer release technology is the most critical technology in MEMS surface process technology, which is mainly to form the cavity and movable space of MEMS devices. This paper briefly introduces the principle, advantages and disadvantages of the sacrificial layer release technology , introduce three type sacrificial layer materials: silicon oxide, polyimide and polysilicon. and discusses these three sacrificial layer materials application direction and application production. And do brief summary on the sacrificial layer release technology.

關鍵字

MEMS ； Sacrificial Layer ； Oxide ； Polyimide ； Polysilicon

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