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The Risk Compensation Mechanism of Intellectual Property Pledge Financing: American Experience and Enlightenment

摘要


The risk compensation mechanism of intellectual property pledge financing plays an important role in promoting the efficient use of intellectual property rights, promoting the financing of intellectual property pledge, and perfecting the service mechanism of "intellectual property finance". In China, the risk compensation mechanism of intellectual property pledge financing is an active attempt to develop and perfect the intellectual property application market, which is still in its infancy, and there are many problems in operation. This paper investigates the risk compensation mechanism of intellectual property pledge financing in the United States, compares it with that of China, and puts forward that China should encourage private capital to enter the market of intellectual property pledge financing, construct the guarantee system of multi-party cooperation, establish and perfect the intellectual property transaction mechanism and trading platform, so as to benefit the perfection of the risk compensation mechanism of intellectual property pledge financing in China.

參考文獻


Xie Liwei. The Intellectual Property Financing Mechanism of the United States and Its Enlightenment [J]. Science & Technology Progress and Policy, 2010 (1).
Devashis, M. The Role of Crowd Funding in Entrepreneurial Finance[J]. Delhi Business Review, 2012(2).
Xiong Xuehua. International Comparison and Enlightenment of the Financing Model of Intellectual Property Pledge in Science and Technology Enterprises[J]. Accounting and Finance, 2017 (1).
Zhu Jiajun, Zhou Fangzhao. Certified Asset Purchasing Price and its Inspiration —— Reflection on Perfecting China's Intellectual Property Financing Guarantee[J]. Journal of Shanghai University of International Business and Economics, 2015 (6).
Yang Fan, Li Di, Zhao Dong. Risk Compensation Fund of Intellectual Property Pledge Financing: : Mode of Operation and Development Strategy[J]. Science & Technology Progress and Policy, 2017 (12).

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