摘要
當印刷電路板（Printed Circuit Board, PCB）在回焊爐進行表面貼焊技術（Surface Mount Technology, SMT）時，PCB會因材料的差異而膨脹程度不同，導致PCB出現形變翹曲，進而造成焊接空洞或枕頭效應（Head-in-Pillow, HIP）。傳統以線性、雙線性，甚至分區形變補償都無法快速且精準的對PCB電路圖形變補償。本文提出了一種使用紋理映射補償演算法，依據多點位模型（multi-point model）來計算非線性邊界修正量（correct straight trace），並利用對位點斜率關係產生非均勻內插控制點數，最後使用工業電腦內建GPU搭配OpenGL的紋理映射硬體加速，提升運算速度，使原始曝光電路圖能快速重新校準，符合PCB的基板形變。實驗結果顯示，本文提出的方法能夠快速的進行PCB基板形變補償，並且能夠解決PCB基板精度偏低問題。
並列摘要
When printed circuit board (PCB) in reflow oven with Surface Mount Technology (SMT) process, the degree of expansion of each material in PCB are different, it causes PCB warpage and may cause soldering empty and head in pillow(HIP). Traditional methods like linear, bilinear, and partitioning are not able to compensate for PCB circuit quickly and accurately. This study proposes a nonlinear distortion correction algorithm using texture mapping, which calculates the nonlinear straight trace according to the multi-point model and board registration holes. And the non-uniform interpolation control points are generated by using the slope relationship of the registration points. Finally, the GPU is matched with the OpenGL texture mapping hardware to speed up the operation, so that the original exposure circuit diagram can be quickly recalibrated to conform to the substrate deformation of the PCB. In the experimental part, the actual measured values of the two sets of PCB pairs were used and compared with the bilinear interpolation method. The experimental results show that the method proposed in this study can quickly compensate PCB substrate and solve the problem of low accuracy.