- 學位論文
晶圓代工產業的成長維度與高階人才策略：以台積電為例
The Growth Dimension of the Foundry Industry and the Strategy of High - level Talents: A Case Study of TSMC
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摘要
台積電相對國外半導體大廠，算是後起之秀，但是憑藉著卓越的經營管理績效，業績不斷成長，至今仍為晶圓代工領域市佔率第一名 (2016年59%)的公司。本研究將探討台積電的成長維度、研發技術與高階人才策略三個主題。 本研究利用五力分析探討半導體晶圓代工目前的產業競爭狀況，以價值鏈模型分析探討台積電內部有哪些主要與輔助活動的配合，以造就公司的大幅成長，再以垂直整合分析成長維度。 本研究顯示台積電的研發利用資源整合、創新，採取多平台同步開發與夜鷹計畫，讓研發24小時日夜不間斷等策略，讓台積電的製程技術不斷提升，從1992年的0.8um到2017年初的10nm，進入製程技術領先群。以垂直整合策略，在上游投資關鍵設備廠商ASML，或與其他設備大廠合組聯盟，便於早期快速取得關鍵設備。在本業以併購方式取得更大產能，超越對手。下游的部分除了建立Third-party 廠商如：日月光外，自行研發高階扇行封裝技術，順利引進新客戶使用先進10nm搭配高階扇行封裝技術進入量產，將進入門檻築高，甩開競爭者。從上游、本業、下游的垂直整合將價值鏈往下延伸，提高競爭力。 台積電在張忠謀董事長的帶領下，往世界級的公司邁進中。本研究針對台積電副總以上的主管學、經、歷背景做分析，歸納後得出，歷練過營運、研發、國際視野者將比較有機會進入接班熱區，成為接班人。
並列摘要
TSMC relative to foreign semiconductor manufacturers, be a rising star, but by virtue of the excellent management performance, continues to grow, is still the chip foundry market share of the first (59%) 2016 companies. This study will explore the three topics of TSMC's growth dimension, R & D technology and high-level talent strategy. In this study, we use the five-force analysis to explore the current industrial competition status of semiconductor foundry, analyze the main and auxiliary activities in TSMC with the analysis of value chain model to make the growth of the company, and then analyze the growth dimension by vertical integration. This study shows that TSMC's R & D and utilization of resources integration, innovation, multi-platform simultaneous development and Nighthawk plan, so that 24-hour day and night uninterrupted strategy, so that TSMC's process technology continues to improve, from 0.8um in 1992 to 10nm at the beginning of 2017, into the process technology leading group. Vertical integration strategy, in the upstream investment key equipment manufacturers ASML, or with other equipment manufacturers consortium alliance, easy early access to critical equipment. In the industry to achieve greater capacity to acquire, beyond the opponent. The downstream part of the establishment of third-party manufacturers such as: the ASE group, the development of high-end fan-out packaging technology, the successful introduction of new customers to use advanced 10nm with high-end fan-out packaging technology into mass production, will enter the threshold to build high, throw off competitors. From the upstream, the industry, the vertical integration of the downstream value chain will be extended to improve competitiveness. TSMC under the leadership of Chairman Morris Chang, to the world-class companies in the forward. This study is based on the analysis of the TSMC vice president of the above, according to the education and experience background to do the analysis, summarized after the experience of operation, research and development, global vision will have the opportunity to enter the successor hot area, as a successor
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