一般電路板的設計,接地是將一些不需要的雜訊和突波消除或降低的一個方法之ㄧ,對於電路的設計者而言,必須詳細的考慮接地的方式。此次實驗將針對如何避免串音現象的發生以傳輸線的形式作一個探討與分析,並在傳輸線之間以接地的方式以及孔洞的週期性變化做一個詳細探討。 本論文是以IE3D模擬軟體進行模擬,來探討接地的方式以及數量,進而對於模擬結果以實際量測的方式進行驗證。我們將針對兩個主題進行討論,首先是對於兩條傳輸線之間的地平面進行孔洞的週期性變化,其次是針對接地的數目逐一做一個探討。 在一般PCB板的設計時,串音的干擾是相當嚴重的問題。一般解決方式會在兩傳輸線之間加上大量的接地點,藉由大量的接地點方式來降低線路之間彼此的耦合效應。我們希望能藉由一連串的實驗來驗證,希望能減少接地點的使用,以及藉由兩傳輸線之間孔洞的變化達到一定的效果。
Generally, grounding is the primary way to reduce and eliminate the noise and pulse in design PCB. The problem of the grounding way needs to be carefully considered by a designer. Therefore, in this study, we discuss the grounding way and the change of via which can prevent the cross talk effect with the transmission line. In this study, we use the IE3D to do this simulation, and find the way and numbers of grounding. We also do experiment to contrast the result of simulation and experiment. And we use the change between with two transmission line including via of cycle and ground. Crosstalk is quit critical problems at generally design of print circuit board. We usually use a large numbers of grounding to solve the problem. We hope we can use this study to reduce the numbers of grounding or change the number of via and to reach the equal result.