- 學位論文
運用於矽穿孔關鍵尺寸量測之彩色共焦顯微技術發展
Development of Chromatic Confocal Microscopic Technique for Measuring Key Dimension of Through Silicon Vias
摘要
本研究應用彩色共焦顯微技術為基礎，進一步發展成為適合量測矽穿孔之光學色散鏡頭及單擊式(one-shot)光學量測探頭系統，矽穿孔(Via)是連接三維積體電路各層的通道孔，但其深寬比值一般為3或5，甚至更高，已接近高深寬比，很難以傳統光學量測的架構，以斜向反射的方式接收光源訊號進行，本研究的目的為開發一套高量測速度、高準確度及高精度且不須垂直掃描或複雜計算之自動化光學檢測系統，藉由光纖來連接所有系統元件，可以減少因組合零件而產生的系統誤差，且同時縮小探頭體積使其易於組裝與調整。 本研究發展的系統屬單點式檢測，不適用於大區域的全域掃描，且同時因配合高深寬比的矽蝕刻深孔來設計色散物鏡之數值孔徑，最高的量測深寬比可達5:1，可以接收到的反射光角度較小(約為正負4度)，故不適用於大傾角的曲面量測，也因為同一個原因，對於會使光散射到不同角度的散射面，也不適合使用此探頭作為大傾角曲面量測檢測工具。 本研究使用深350 μm、直徑為60 μm之矽蝕刻深孔來測試開發的系統，經過30次的重複量測實驗並計算後，其結果的量測標準差約為0.07微米，可以小於全量測深度範圍的0.1個百分比，此證明本系統具備足夠之穩定性，並且能和線上檢測機台進行整合與應用。
並列摘要
In this thesis, a chromatic confocal microscopic system using fiber coupler for silicon via depth inspection is proposed and implemented. Through silicon via (TSV) plays an important role in integrated circuit connect between layers. The high aspect ratio of TSV makes it difficult to be measured by traditional measurement methods. This research develops one confocal microscopic system that is designed for high speed, accuracy and precision single point automatic optical inspection without scanning and time consuming calculation. The system is connected only by fibers. The potential measurement error that may occur in system construction can be effectively eliminated. It also reduces the volume of whole system and makes it easier for industrial application. The system developed in this research is not suitable for measurement with large area. The objective lens with small numerical aperture limits the incident light that make it cannot measure things with large tilting angle or surfaces which scatter light to random direction. In experiment, high aspect ratio via with depth around 350 μm and diameter around 60μm is used as sample to verify the system. After thirty times experiment, the standard deviation of result is around 0.07μm and it is smaller than 0.1% actual value. The developed system can be cooperated with in-situ machines and applied to production inspection.