互補式金氧半導體晶片打線研究以及高畫質影像無線傳輸

Complementary Metal-Oxide-Semiconductor Bonding Study and Wireless High-Definition Video Transmission

張主禧(Joseph Chong)

指導教授 ： 黃天偉

國立臺灣大學/電機資訊學院/電機工程學研究所/碩士(2008年)

https://doi.org/10.6342/NTU.2008.01624

摘要

IEEE802.15.3是設定60GHz附近頻帶之無線個人網路的標準。
藉著在60GHz附近非常寬的頻寬，無線轉輸的資料量可以達到每秒十億位元(Gbps)的資料量。高畫質影像無線傳輸是該標準製定者群提出的其中一項應用。為了使多顆晶片可以封裝在一起，我們必須釐清晶片打線對電路效能的影響。實驗指明打線的電感值比預期小。
另外，我們也對高畫質影像無線傳輸作了測試。含有1.485Gbps資料量的1080i高畫質影像被載到40GHz的頻帶，然後傳輸了1.5公尺的距離。

關鍵字

CMOS ； 打線 ； 無線 ； 高畫質 ； 60GHz

並列摘要

IEEE802.15.3 is a WPAN standard for wireless transmisson at 60GHz band.With the wide bandwidth around 60GHz it is possible to implement high data-rate,transmitting up to Gbps speed. One of the proposed usage is the wireless transmission of high-definition multimedia content.
In order that several chips could be packaged in a module, the effect of bondwire needs to be clarify. Experiment shows that wire-bonding for CMOS chip is much smaller than predicted. Wireless HD video transmission is also tested.
The 1080i HD video, data-rate 1.485Gbps, is up-converted to 40GHz band, and transmitted over 1.5m distance.

並列關鍵字

CMOS ； bondwire ； wireless ； high-definition ； 60GHz

參考文獻

[1] International Telecommunication Union.

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[5] A. F. Molisch, Wireless Communication. John Wiley & Sons, 2005.

[6] T. H. Lee, “From oxymoron to mainstream: The evolution and future of rf cmos,” IEEE International Workshop on Radio-Frequency Integration Technology, December 2007.