- 學位論文
應用於5G毫米波之雙頻雙極化天線與前瞻封裝天線之設計與研製
Design and Implement of Dual-Band Dual-Polarized Antennas and Advanced Antenna-in-Package for 5G Millimeter Wave Applications
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摘要
本論文探討如何設計應用於5G毫米波頻段的雙頻雙極化天線與封裝整合天線模組。本論文提出的毫米波雙頻雙極化天線是採用波導模態分析方法，達到28/38 GHz雙頻與雙極化的功能。製程採用低成本之平面印刷式多層電路板，實現槽孔和共振背腔式設計。天線饋入架構為微帶線，易與射頻電路做整合。所設計天線之特性經過實驗驗證，其10-dB為基準的返回損失、埠與埠隔離度與輻射場型皆和模擬結果有良好的吻合度。本論文中也更進ㄧ步利用該雙埠天線，實現一乘四天線陣列架構，天線陣列量測結果也顯示與數值模擬結果有良好的吻合度。就我們所知目前在毫米波頻帶的文獻中，本論文所提出的天線架構是第一個證實具備有雙頻雙極化功能的天線。 本論文所提出的毫米波封裝整合天線，是採用覆晶式與層疊式兩種封裝方式來整合天線與晶片。藉由此兩種封裝方式，成功地將一發射與三接收共四支天線封裝整合至60-GHz毫米波雷達單晶片上。所設計天線之特性經過實驗驗證，其10-dB為基準的返回損失、埠與埠隔離度與輻射場型皆和模擬結果有良好的吻合度。最後成功將毫米波雷達模組縮小至總封裝尺寸6 × 6.5 × 1.1 mm3，並在系統測試上得到雷達功能驗證。就我們所知目前的文獻中，本論文所提出的封裝天線架構是第一個證實成功將4天線整合至60-GHz雷達系統單晶片的封裝。
並列摘要
In this dissertation, we investigate how to design a dual-band and dual-polarized antenna and how to develop a compact antenna-in-package for 5G millimeter-wave (mm-Wave) applications. The proposed dual-band and dual-polarized antenna is based on the analysis of waveguide modes operating in the 28- and 38-GHz bands. The resultant antenna design was illustrated by the low-cost printed circuit board (PCB) process. The presented antenna comprised a cavity-backed aperture loaded with dual-band resonators and two orthogonal feed ports for dual polarization operations. The feeding structure is a microstrip line which is easy to integrate with RF circuit. The proposed antenna was verified by experimental results, including the 10-dB return loss, the port-to-port isolation, and radiation patterns. The measured and simulated results were consistent. We further extended the proposed antenna design with a 1-by-4 array. To our knowledge of current literature, the presented work is the first comprehensive dual-band and dual-polarized antenna design in millimeter-wave bands with experimental validation. In this dissertation, we also investigate an antenna-in-package (AiP) design for millimeter-wave radar applications. Using the flip-chip and package-on-package (PoP) technologies, we integrate four antennas with a single die of 60-GHz radar system on chip (SoC) containing analog transceiver and digital DSP with AI accelerator. We achieved a highly integrated AiP radar module in an ultra-compact size of 6.0 × 6.5 × 1.1 mm3. To our knowledge of current market, there lacks a 60-GHz AiP structure integrating radar SoC with such a compact package of planar size.
參考文獻
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