- 學位論文
對於工作站式筆電的熱管散熱器之散熱能力提升
Improvement of Power Capacity for Station Laptop with Heat Pipe Cooling Module
摘要
論文提要內容： 本研究的重點是提高專門為了影片編輯和3D建模設計的高性能筆記型電腦冷卻模組的功率容量(power capacity)。其中是在 Compal Electronic Company 的熱對策部門實習期間專門使用 Dell Precision 筆記型電腦進行。 增加冷卻系統功率容量對筆記型電腦性能的直接影響。 原裝散熱模組支持 30W 的 CPU 容量和 60W 的 GPU 容量。 通過增加冷卻系統功率容量， 可以顯著提高筆記型電腦的性能。 為滿足這一需求而進行了設計修改，主要集中在熱管、CPU區域的散熱片和風扇尺寸調整上。 在完成這些改進後，創建了一個 3D 模型（本文稱為 design of experiment 1( DOE1) 模塊）並在生成物理原型之前進行了模擬。 接續在實驗中針對原始散熱模組進行測試。 將 design of experiment 1 (DOE1) 模組與原始散熱模組進行比較的結果表明，冷卻系統的能力從 30W CPU 和 60W GPU 增加到 30W CPU 和 84.9W GPU。 這表明擴大風道、增加散熱器和增加風扇尺寸有效地增強了系統的冷卻能力。 應該注意的是，這些設計修改受到每台筆記型電腦的特定限制所施加的限制，例如用於擴展組件的可利用空間。
並列摘要
This study focuses on enhancing the power capacity of the cooling module in a high-performance workstation laptop designed for video editing and 3D modeling tasks. The research was conducted during an internship at Compal Electronic Company's Thermal Department, specifically working with the Dell Precision workstation laptop. The direct impact of electricity on laptop performance creates a need to improve the cooling system's power capacity. The initial thermal module could support a CPU power of 30W and a GPU power of 60W. Performance on the laptop can be sharply increased by raising the capabilities. Design modifications were made to address this need, primarily focusing on heat pipes, heatsinks in the CPU area, and fan size adjustments. After finalizing these improvements, a 3D model (referred to as the design of experiment 1 (DOE1) module) was created and simulations were conducted before producing the physical prototype. The prototype was then tested against the original thermal module in practical experiments. The experimental results comparing the design of experiment 1 (DOE1) module with the original module demonstrated an increase in the cooling system's capability from 30W CPU and 60W GPU to 30W CPU and 84.9W GPU. This indicates that enlarging the duct, adding a heatsink, and increasing the fan size effectively enhances the cooling capacity of the system. It should be noted that these design modifications are subject to limitations imposed by each laptop's specific constraints, such as available space for scaling up components.