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  • 學位論文

銅/鋁製導熱板與鰭片之散熱性能比較分析

Comparative Analysis Thermal Performance between Copper and Aluminum as Heat Plates and Fins.

指導教授 : 王銀添

摘要


熱傳遞是許多行業中,包括電子和汽車等,非常重要的一個方面。銅和鋁是熱板和散熱片中最常用的材料,但它們的選擇取決於成本、熱導率和重量等多個因素。本研究旨在通過模擬和實驗比較銅和鋁作為熱板和散熱片的性能,以確定在熱傳遞應用中最具成本效益的解決方案。實驗在15瓦的負載和25攝氏度的室溫下進行,並記錄了CPU的溫度測量。研究包括一個實驗設置,用於測量CPU、熱板和散熱片的溫度和熱阻。結果顯示,銅熱板配合銅散熱片的熱性能最佳,CPU溫度達到85. 9攝氏度。銅熱板配合鋁散熱片的溫度增加了1%。鋁熱板配合銅散熱片的溫度進一步增加了2%,而鋁熱板配合鋁散熱片的溫度最高,達到90.5攝氏度或比銅熱板配合銅散熱片溫度增加了5%。分析材料選擇的重要性,觀察到銅具有優異的熱導率,提供了卓越的熱傳遞能力。然而,使用鋁時CPU溫度的增加相對較小。本研究的結果將提供有關銅和鋁作為熱板和散熱片的熱性能和成本效益的信息,並幫助工程師在選擇熱傳遞應用材料時做出明智的決策。

關鍵字

傳熱 熱阻 數值模擬

並列摘要


Heat transfer is a critical aspect in many industries, including electronics, and automotive. Copper and aluminum are the most commonly used materials for heat plates and fins, but their selection depends on several factors such as cost, thermal conductivity, and weight. This study aims to compare the performance between copper and aluminum as heat plates and fins with simulation and experiment to determine the most cost-effective solution for heat transfer applications. The experiments were conducted under a stress load of 15W and an ambient room temperature of 25 degrees Celsius, with temperature measurements recorded for the CPU. The research involves an experimental setup that measures the temperature and thermal resistance from the CPU, heat plates and fins. The results showed that the copper heat plate with copper fins demonstrated the best thermal performance, with the CPU temperature reaching 85.9 degrees Celsius. The copper heat plate with aluminum fins increase temperature 1%. The aluminum heat plate with copper fins recorded further temperature increases 2%, while the aluminum heat plate with aluminum fins showed the highest temperature reading of 90.5 degrees Celsius or increase 5% from copper heat plate with copper fins temperature. Analyzing the significance of material selection, it was observed that copper, with its excellent thermal conductivity, provided superior heat transfer capabilities. However, the increase in CPU temperature when using aluminum was relative. The results of this study will provide into the thermal performance and cost-effectiveness of copper and aluminum as heat plates and fins and help engineers to make informed decisions in selecting materials for heat transfer applications.

並列關鍵字

Copper Aluminum Heat transfer Thermal resistance Simulation

參考文獻


References
[1] Li, Meimei Zinkle, S.J.. (2012). Physical and Mechanical Properties of Copper and Copper Alloys.
[2] William D. Callister, JR David G. Rethwisch. (2014). Materials Science and Engineering an Introduction, 9th Edition.
[3] Theodore L. Bergman, Adrienne S. Lavine, Frank P. Incropera. (2011). Fundamentals of Heat and Mass Transfer, 7th Edition
[4] Yao Huang, Zexin Li, Lucai Wang , Leilei Sun, Xiaohong You, Wenzhan Huang and Fang Wan. (2022) Preparation and Heat Dissipation Properties Comparison of Al and Cu Foam.

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