- 學位論文
USB3.0 訊號完整度與Choke 匹配差異研究
Research on the Difference between USB3.0 Signal Integrity and Choke Matching
摘要
本論文提出，應用 QUALCOMM SDM660 集成晶片平台及整體線路路徑經 過的零組件，包含PCB 電路板及不同電阻值的共模電感、電容、電子連接器之參數，並套用至 Power SI 軟體建立零組件之模組化並取得其 S 參數，再應用System SI 軟體做 USB3.0 整體訊號模擬及規劃，並分析出不同電阻值的共模電感對於高速訊號的影響程度，此做法能夠讓操作者在 PCB 電路板尚未定案前，就能夠提早知道在此情況下的訊號走線和使用零件(共模電感、電子連接器)對於高速訊號的優劣影響程度，也可以及早對此作出修正，並可以降低生產成本及研發成本，也可增加研發速度，最後再利用高頻寬示波器對待測物實際量測，驗證模擬結果。
並列摘要
This paper uses the QUALCOMM SDM 660 CPU and other components to construct an overall circuit path, including the PCB, Common Mode Choke with different resistance values, and Connector. The proposed method uses Power SI software to build modulation for all components and calculate the S parameter. Then use System SI software to do USB3.0 overall signal simulation, and analyze the impact of Choke with different resistance values on super-speed signals. This method allows operators to know the situation before the PCB fixed. The following signal routing and components(such as Choke, and Connector)can also be corrected early. This method not only can reduce production costs and development costs, but also can increase the speed of research and development. Finally to make the method more reliable, so we verify the simulation result in this method by using the high-bandwidth oscilloscope for actual measurement.