- 學位論文
新式板接板連接器組配機構分析
Analysis of a Novel Board-to-Board Connector Assembly Mechanism
摘要
此篇技術報告主要為在英業達公司機構部門實習一年所學習到有關筆記型電腦機構部分相關的知識，包括有關筆記型電腦機構部份的筆電製程、分析連接器製程能力的首件檢驗及精準度綜合指標等。除此之外為了得到理想的成果也學習了在與別的部門或廠商溝通合作時需要注意的部分，避免無效的溝通及失敗的結果。 筆記型電腦內部的連接器眾多，許多連接器廠商也為開發更輕薄並同時提高傳輸效能的連接器而開發出新款的連接器，本篇技術報告將介紹其中一種近年來各連接器廠商陸續推出的新式板接板連接器，目前與公司洽接有關新式板對板連接器的廠商有四家，但因廠商皆無法提供連接器細部結構，因此本分報告將首先會針對廠商提供的2D、3D以及實際樣品作以對比，觀察樣品在實際製造後與初始設計值的差異比較。 因為此產品是為了取代多端子數及高傳輸的連接器，雖四間廠商所推出的產品在巨觀上大同小異，但在顯微鏡下觀察內部設計及端子形狀卻大相逕庭，而後面篇文將再利用影像顯微鏡觀察連接器本體以及剖面的結構並作以分析，並詳細介紹各廠商設計的連接器機構內部不同，以及對於端子設計的不同在實際應用上可能會產生的問題做為討論。
並列摘要
This technical report summarizes the knowledge gained during a year-long internship in the organizational department at Inventec Corporation. The focus was on understanding various aspects related to laptop internal architecture, specifically the mechanisms governing notebook connectors. Topics covered include laptop manufacturing processes, First Article Inspection (FAI), and process capability indices (Cpk). Additionally, the report highlights effective communication strategies when collaborating with other departments or external vendors to achieve optimal outcomes. Laptop internal connectors play a crucial role in ensuring seamless functionality. As laptops become thinner and more powerful, connector manufacturers continuously innovate to develop novel board-to-board connectors. This report introduces one such category of connectors that various manufacturers have recently introduced. Currently, four vendors are actively engaged in producing these new board-to-board connectors. Unfortunately, detailed structural information about these connectors is not readily available from the manufacturers. Therefore, this report begins by comparing the 2D, 3D representations, and actual samples provided by the vendors to assess any deviations between the manufactured connectors and their initial design specifications. While the overall design of the products from the four manufacturers appears similar, microscopic examination reveals significant differences in internal architecture and terminal shapes. Subsequent sections will employ optical microscopy to closely examine the connectors’ physical structure and cross-sectional profiles. Through detailed analysis, we will explore the unique internal mechanisms designed by each manufacturer. Furthermore, we will discuss potential practical implications arising from variations in terminal design.