半導體設備標準通訊協定SECS已普遍應用於半導體、平面顯示器(FDP)、太陽能光電設備,主要是用來跟上位系統(Host)介面整合。本研究論文基於TCP/IP實作SEMI半導體設備通訊協定HSMS(High-Speed SECS Message Services)通訊介面服務,開發SECS-II(SEMI EQUIPMENT COMMUNICATIONS STANDARD 2 MESSAGE)函式庫,利用HSMS通訊介面與SECS-II函式庫實作SECS模擬器(Simulation),藉由第三方軟體之驗証HSMS通訊介面服務與SECS-II函式庫,希望能實際運用於產業上之半導體設備通訊介面的整合測試與發展。本論文採用微軟Visual Studio 2010 C#物件導向開發工具,並利用混合同步/非同步Socket撰寫一符合HSMS服務介面(含Active端與Passive端的通訊介面),並整合成為可以設定參數、編輯訊息(Message)、交易(Transaction)和劇本(Scenario)的模擬器,以方便進行半導體設備端或是Host端通訊介面之測試之應用。
Semiconductor Equipment standard protocol SECS (SEMI Equipment Communication Standards) has been widely used in semiconductor, flat panel display (FDP), solar photovoltaic equipment manufacture industries to integrate the communication interface with the Host system. This thesis is developed based on TCP / IP to implement HSMS (High-Speed SECS Message Services) communications interface services and SECS-II (SEMI EQUIPMENT COMMUNICATIONS STANDARD 2 MESSAGE) library and by both libraries to develop SECS simulator. A third-party software (WinSECS) is used to verify the HSMS communication service and SECS-II libraries. The results show that the libraries can be used in the semiconductor industry for communication interface testing and development. Microsoft Visual Studio 2010 C # object-oriented language is used for the development of hybrid synchronous / asynchronous Socket implementation of HSMS service interface (including Active and Passive client side communication interface) and SECS-II library. A simulator adopted to set the parameters and such that to edit message, then it can be used to facilitate the testing of semiconductor devices or client-side communication interface of Host.