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  • 學位論文

基於單機板多設計之高解析度AFE實作

Implementation of High-resolution AFE Based on Single-board Multi-designs

指導教授 : 陳建中
共同指導教授 : 黃文增(Wen-Tzeng Huang)

摘要


隨著科技的進步,攝影機的解析度效能已超越全高畫質(Full-HD, 1920 × 1080)的規格。其中,類比前端(AFE, Analog Front End)電路是決定高解析度攝影機的成像系統品質之主要因素。因此,本研究是應用On Semi CCD影像感測器,設計出一套類比前端模組具有可支援4款解析度(1M - 100萬像素的簡稱、2M、4M、或8M)。和原廠所提供公板的效能比較如下。原廠PCB尺寸(113 mm × 101 mm)比較,本研究的AFE模組PCB尺寸(48 mm × 48 mm),符合部分CMOS的外觀設計。本研究系統量測SNR效能比原廠平均提升約9.6%。更進一步,我們使用2336 × 1752的影像感測器來量測系統的空間解析度。經由Imatest的分析結果,於MTF50的水平與垂直效能量測,公板的是1463 LW/PH (Line Width / Picture Height) 及949.1 LW/PH,我們設計於水平效能量測達1680 LW/PH與垂直1396 LW/PH。因此,以上結果證明本研究所設計的AFE模組,可作為一個可靠的類比前端處理單元。

並列摘要


With the technology progress, the performance of the high-resolution camera has been beyond full high-definition (Full-HD, 1920 × 1080) specifications. Among them, the AFE (the analog front end) circuit is the major factor to determine the image quality of the high-resolution camera. Therefore, this study applies On Semi CCD image sensor to design an analog front end (AFE, Analog Front End) module, which can support 4 type resolutions, 1M (1 million pixels), 2M, 4M, or 8M, respectively. Compared with the original public board (OPB) performance, the original PCB size is 113 mm × 101 mm of AFE module and our design is 48 mm × 48 mm, whose size can be consistent with part of the CMOS design. SNR of our design is higher 9.6% than that of the OPB. Moreover, we employ the resolution of 2336 × 1752 image sensor to measure the amount of space the system resolution. By analyzing the results of Imatest in horizontal and vertical MTF50 performance, compared with 1463 LW/PH (Line Width / Picture Height) and 949 LW / PH of OPB, our design is about 1680 LW/PH and 1396 LW / PH. Therefore, the above results prove that the AFE module of our design can be used as a reliable AFE processing unit.

參考文獻


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