摘要
電磁相容(Electro-Magnetic Compatibility, EMC)是當今系統設計中一個重要的考慮因素，其限制也將會隨著電子資訊科技的發展而變得更加嚴格。尤其當信號發生交換時，雜訊也將會跟隨著出現，無論是傳導雜訊還是輻射雜訊，隨著各種電子產品的高速化、小型化及環保意識抬頭，電子產品所產生之電磁干擾(Electro-Magnetic Interference，EMI)已經成為不容再忽視逃避的問題。因此、如何做到電磁相容設計有效的先期導入作業，符合國際電磁相容法規的要求，已成為現今電子產品電磁相容設計重要的課題。 本論文乃針對資訊技術設備(Information Technology Equipment, ITE)電磁干擾的幾種現象之探討。電磁干擾問題可以透過良好的電路設計、適當的元件擺置位置，及佈局技巧加以解決，透過適當的設計我們可以將電磁干擾減到最小符合法規要求。本文中將透過實際的量測數據，結合模擬軟體分析，藉以獲得適當的初步對策。最後再以實際量測驗證對策結果，以達到有效的對策導入，降低產品設計週期，以及開發成本的目的。其討論範圍含蓋了印刷電路板輸出、入埠，輸出、入連接插頭，及系統機架、機箱等的電磁干擾問題分析與對策。 經由本文的探討、對於其所提供之電磁干擾分析技巧及問題解決方法，希望能夠對電磁相容設計有實質的助益。
並列摘要
The EMI (Electro-Magnetic Interference) noise generated from electronic devices is a critical and serious problem since various devices grew up to become as fastest data transmission rate, miniaturized device size, and environmental consciousness rose. Thus, how to do performative EMC (Electro-Magnetic Compatibility) effectual design in electronic device at early development stage to meet worldwide EMC regulations that it is turning into an important topic in nowadays. The theme of studying in this thesis is EMI integrated design techniques for ITE (Information Technology Equipment). EMI problem is doable to be solved by suitable circuit design, fitting components placement, and advisable layout that we could be minimized noise energy to get device to meet regulations by excellent design. In the studying, it would go through analysis by real case measuring to integrate with simulation result, so as to get a good fit preliminary EMI solution, and what is more, perform final verification by far field measuring. The purpose of the goal is targeting on the effectively to solution implementation, shorten development cycle, and drop development cost. The main theme of discussion is inclusive of EMI issue analysis and solution of PCB I/O port, I/O connector, and bracket chassis in enclosure. By way of the theme discussion, the EMI analysis technique and its solution about the problem saving as shown in text, I hope to it could be able to provide positive benefit for EMC design.
參考文獻
1. Clayton R. Paul., "Introduction to Electromagnetic Compatibility", John Wiley & Sons, INC., 1992.
2. Stephen H. Hall, et al., "High-Speed Digital System Design: a handbook of interconnect theory and design practices", John Wiley & Sons, INC., 2000.
3. Michel Mardiguian, "EMI Troubleshooting Techniques", McGraw-Hill, July 1999.
5. Mark I. Montrose, "Printed Circuit Board Design Techniques for EMC Compliance", IEEE Press, 1996.
7. Mark I. Montrose, "EMC and the Printed Circuit Board: Design, Theory, and Layout Made Simple", IEEE Press, 1999.