鑽石砂輪材質對晶圓輪磨品質之關係研究

Study on correlation between wafer quality and diamond wheel material

李蔚杰(Wei-Chieh Lee)

指導教授 ： 蘇艾

元智大學/工程學院/機械工程學系/碩士(2011年)

https://doi.org/10.6838/YZU.2011.00117

摘要

在目前半導體封裝產業的製程中，一項重要的因素便是晶片厚度，在封裝製程中晶圓厚度增加的需求以及相對薄晶片的優點，使得晶圓薄化技術愈形重要。
本研究主要探討半導體晶圓薄化技術的機械式輪磨所使用的鑽石砂輪，其中砂輪齒的鑽石粒度大小、結合劑成份及燒結後砂輪齒的排列等砂輪製程中重要的項目做探討。研究主要利用包含日本、韓國、美國等目前世界上主要砂輪製造商的細磨8000#砂輪樣品做比較；其中實驗測試的項目共五項，分別為: 晶圓表面粗糙度、晶圓應力強度、邊緣崩裂、砂輪磨耗量以及主軸電流過載量的實驗。
實驗主要以半導體空白晶圓為實驗對象，使用生產用參數和半導體專用輪磨機台做測試，並站在企業的角度，以品質及成本兩大主要觀點，透過實驗比較出最適合公司製程的砂輪，了解砂輪成分和測試結果的關係，如何在其中取得最佳的平衡點，達到挑選最適合砂輪的目的。
由研究結果得知砂輪材質於輪磨後品質及使用成本之間影響的關係，得出了『沒有最好的砂輪，只有最適合的砂輪』的結論。因為鑽石粒度的大小直接影響了磨削力大小、表面粗糙度、應力強度及主軸電流過載量；結合劑的材質則牽涉了表面粗糙度、主軸電流過載量和砂輪使用壽命，兩種材料比例上的搭配會產生出非常多種的結果，而如何在品質及成本中找到最佳的平衡點才是相關從業人員所面臨最重要的課題。

關鍵字

輪磨 ； 鑽石砂輪 ； 晶圓薄化 ； 8000#砂輪

並列摘要

One important factor in semiconductor packaging industry is chip thickness. During the process relatively thinner chip is favored in terms of technology trend.
In this study, diamond wheel that used for mechanical grinding and polish for wafer thinning process is discussed, with special focus on diamond grit size, adhesive composition and post-furnace vent size. The grinding wheels used were 8000#, from major market suppliers from Japan, Korea and USA. The test items were wafer surface roughness, die strength, edge chipping, life time and spindle current loading experience.
Dummy silicon wafer were exercised with standard manufacturing process recipe on commercially available grinding machine. In terms of manufacturing perspective, cost and quality are the two key aspects. How to find the balance between the two in choosing suitable wheel has always been the question, and this study is the attempt for the resolution.
The result of correlation from this study in between wheel material,wafer quality and the cost. It shows "there is no the best grinding wheel but the most suitable one ". It because the diamond grit size can be the direct factors of grinding force,surface roughness,die strength and spindle current overloading experiment, and further more the adhesive composition affected the surface roughness,spindle current overloading experiment and life time of grinding wheel. There will have various effects resulted from the proportion of two different materials, and so the most important key point is how to balance the products quality and cost.

並列關鍵字

Grinding ； Diamond wheel ； Wafer thinning ； 8000# wheel

參考文獻

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