半導體封裝測試產業發展策略與財務分析

2014年為半導體產業近年來最風光的一年，擺脫PC衰退的陰影，受惠於行動裝置強勁需求，而創下營收與獲利新高。其中，觀察與分析半導體後段製程的封裝測試為本研究主軸。因為電子產品的多樣性，使得後段封裝測試的種類繁多，各家廠商的競爭也較強烈。在電子產品日新月異的時代，半導體供應鏈將如何因應時代潮流製程演進與供應鏈整合以維持競爭優勢，將是本研究需要探討的議題。此外，面對中國大陸半導體產業崛起，台灣的廠商要如何面對挑戰，策略為何，值得我們持續關注與討論。

關鍵字

封裝測試；製程演進；供應鏈整合；中國半導體產業

並列摘要

With portable devide demand ramp at post-PC era, semi-conductor companys have great performance not only revenue but also profit in 2014.I would like to study semi-conductor OSAT company in my research. Due to diverse electronic device, IC package have to develop for many kind of segment, and the competition would be more aggressive each companys.In the ripidly era of electronic product, I would like to know how semi-conductor supply chain to process migration and integration for the competition advantage.In addition, Taiwan how to face the challenge from the rise of China semi-conductor industry.What the stragety we have to plan is our next focus.