系統級封裝(SIP)的封裝材料對被動元件脫層的影響研究

本研究在系統級封裝SIP(System in Package)的封裝體13x13mm新產品導入期間在可靠度驗證(Reliability test)後所遭遇到的液態封止材料(Liquid Encapsulant)與被動元件表面發生脫層Delam(Delamination)，脫層讓被動元件兩端子的錫溢出(Solder extrusion)，嚴重時會讓兩端子的錫橋接(Solder bridge)形成元件短路造成產品電性失效問題，在解決問題時使用QC7工具分析數據、陰影疊文法(Shadow Moire)量測產品翹曲度(Warpage)、實驗設計DOE(Design of Experiment)來確認材料變異以及利用超音波掃描檢SAT (Scanning Acoustic Tomography)檢測脫層問題。由結果得知封裝體的整體應力表現值越低對於可靠度結果越好，翹曲度在常溫和高溫變化量越小可以有效降低被動元件表面脫層風險，將這次的結果加在新產品導入的驗證程序來降低在可靠度完後脫層的風險並且達到客戶需求順利導入量產，讓公司在封裝技術上更有競爭力。

關鍵字

系統級封裝；可靠度驗證；液態封止材料；脫層；錫溢出；錫橋接；陰影疊文法；物料清單；翹曲度；實驗設計；超音波掃描檢測

並列摘要

In this study, during the introduction of SIP (System in Package) 13x13mm new product, there are suffered delam(delamination) issue between the liquid encapsulant material and the passive component surface after the reliability test, this issue caused solder extrusion of the two terminals at passive component side, and in worse cases will cause the solder bridge of the two terminals at passive component side let the product function failure. When solving problems, we used QC7 tools to analyze data, used shadow moire to measure product warpage, DOE (design of experiment) to confirm material variation, and used SAT (Scanning Acoustic Tomography) to detect delamination issue. From the results that the lower overall stress had better performance for reliability result, the smaller amount of warpage changed at room temperature and high temperature can effectively reduce the risk of delamination on the surface of the passive component. The results will be defined in the verification process of new products for delam reduction and meet customer needs to introduce mass production for making the company more competitive in packaging technology.