本研究採用Mirau干涉技術配合顯微鏡系統的量測方式, 開發一套顯微輪廓三維全域量測的設備,其技術領域係結合顯微鏡放大影像功能及干涉技術的精密量測特性,再搭配PZT相移裝置及數位影像系統進行三維全域定量量測。主要架構包含顯微鏡與干涉儀二部分,在顯微鏡方面,先透過機構與光路的分析,將原有的顯微鏡架構改裝成適合與干涉儀結合的架構。干涉儀的設計中,除了干涉系統的選用外,其投光系統也是需要注意的事項,本研究採用LED冷光源,相較於傳統白熾燈,其優點為體積小、不發熱而且省電。 本系統可量測之影像範圍為0.8mm X 0.6mm、水平解析度為1.1µm、垂直解析度可達2.5nm。在實測中針對一核心直徑為125µm、被覆直徑為2mm之FC多膜光纖端面進行量測,重複量測25次,得到待測元件之平均球面曲率半徑為170mm,量測標準差為7.13mm,平均高度為160.5nm,量測標準差為6.43nm。另一組實驗為針對白光LED前端直徑為4.8mm之聚光鏡表面進行檢測,經重覆25次量測結果得曲率半徑為50.25mm,標準差為2.11mm。實驗結果顯示本干涉儀已具備應用於微元件表面輪廓量測使用之潛力。
A Mirau type iterferometric microscope system has been developed for small scale surface profile measurement. Two techniques including the image magnification using a microscope and the precision metrology using an interferometer were combined in this system. A traditional optical microscope was remolded and integrated with the interferometric system. By using a PZT phase shifter and the digital image system, the 3D profile data of a specimen can be quantitatively obtained. The red LED was adopted to be the light source of the interferometer, so that the heat disturbance can be avoided and also make the combined system more compact. Experiments were implemented with a fiber connector and a LED micro-lens. The field of view of the imaging system is 0.8 mm x 0.6 mm, the horizontal resolution is 1.1 µm, and vertical resolution 2.5nm. The diameter of the core and the cladding of the fiber are 125 µm and 2mm, respectively. Measurements were repeated 25 times. The average measured fiber height is 160.5 nm with a standard deviation of 6.43nm, and the measured average radius of curvature is 170mm with a standard deviation 7.13mm. Another experiment was the measurement of radius of curvature of a LED micro-lens with a diameter of 4.8 mm. Again the measurements were repeated 25 times. The measured average radius of curvature is 50.25mm with a standard deviation of 2.11mm. From the achievements in the above experiments, the developed system may be applied to the surface profilometry of micro-parts.