近年來隨著網路通訊時代的來臨,高頻高速化的電子產品、電腦高速訊號硬體和軟體快速發展,以及頻率增加與頻寬要求變高與積體電路越趨密集,因此對於數位訊號的頻率與頻寬要求也越來越高。當數位信號的傳輸速度提升,再加上互連元件產品如連接器、線纜或印刷電路板縮小化使電路的佈局越來越緊密,往往會造成訊號完整性(Signal Integrity, SI)、電磁干擾(Electromagnetic Interference, EMI)、電磁相容(Electromagnetic Compatibility, EMC)以及電源完整性(Power Integrity, PI)等問題,因此這些議題要如何解決及最佳化電路佈局是當今很重要的議題。 在電路佈局中,往往會遇到傳輸線與電源平面相鄰的情況,然而在高速數位電路中,若高速線相鄰電源平面,則需間隔一定距離,避免電源平面雜訊耦合到傳輸線上的雜訊過大,進而影響訊號完整性。不僅僅是傳輸線與電源平面的距離,傳輸線與電源平面的平行的長度、電源穿層位置也可能會影響耦合雜訊的大小,本論文即針對上述情況做分析比較。 本論文研究在帶線結構下,依據傳輸線的長短與距離電源平面的遠近,以及輸入電源訊號的位置不同,分析傳輸線上的耦合雜訊。使用HFSS模擬軟體繪製結構,除單根結構之外,也有繪製差模結構,萃取出S參數後使用ADS電路模擬軟體轉換波型,觀察時域反射波型(Time Domain Reflection, TDR)、時域穿透波型(Time Domain Transmission, TDT)、以及差模(Differential)、共模(Common)耦合雜訊,並將結果整理成趨勢圖表。
In recent years, with the advancement of the era of network communications, high-frequency and high-speed electronic products, high-speed signal hardware and software have developed rapidly. As the increase frequency and bandwidth requirements, integrated circuits layout have become more dense, the requirement of digital signals are more high frequency and bandwidth requirements are becoming higher and higher. The process of high-speed digital signal transmission will cause signal integrity (SI), power integrity (PI), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and so on. Therefore, the analysis of related issues on printed circuit board (PCB) and optimize circuit layout will become more and more important. In the circuit layout, it is often encountered that the transmission line is adjacent to the power plane. However, in high-speed digital circuits, if the high-speed line is adjacent to the power plane, it needs to be separated by a certain distance to avoid noise coupling from the power plane to the transmission line. This paper studies the coupling noise on the transmission line according to the length of the transmission line, the distance from the power plane, and the position of the input power signal under the structure of the strip line. HFSS simulation software is used to draw the structure. In addition to the single-end trace structure, there are also differential trace structures. After extracting the S parameters, the ADS circuit is used to convert S parameters to the wave mode. Observe time domain reflection (TDR), time domain transmission (TDT), differential-mode coupling noise, common-mode coupling noise, and organize the results into trends chart.