電源連通柱與數位訊號線之耦合效應

Coupling Effect between Digital Signal Traces and Power Via

吳旻澤(Min-Ze Wu)

指導教授 ： 薛光華

中原大學/電機資訊學院/電子工程研究所/碩士(2020年)

https://doi.org/10.6840/cycu202000512

摘要

在電路系統中，電源的供應是不可或缺的，電源層之間的傳遞就是靠電源連通柱來連接，當電源連通柱穿越兩層金屬平面將造成兩金屬層間的接地彈跳雜訊，另外隨著高速時代的發展，傳輸線路佈線越是密集，以及因為成本考量和產品體積要求而受限制的佈線面積，因此在印刷電路板上電源連通柱附近常常會佈局數位訊號線，本論文主要探討高能量的電源連通柱與數位訊號線之間的耦合效應，以及分析其雜訊的成因與物理機制，最後提出透過調整參數或設計結構來抑制電源連通柱與數位訊號線之耦合效應的方法。

關鍵字

電源連通柱 ； 接地彈跳雜訊 ； 接地連通柱

並列摘要

In the circuit system, the supply of power is indispensable. The transmission between the power layers is connected by the power via. When the power via pass through the two metallic planes, it will cause ground bounce noise between the two metal layers. With the advancement of high-speed era, transmission lines lay out densely. In addition, wiring area limited due to cost considerations and product volume requirements, so digital signal lines are often laid out near the power via in PCB. This paper mainly discusses the coupling effect between high-energy power via and digital signal lines, and analyzes the cause and physical mechanism of noise. Finally, this paper proposes to adjust parameter or designs the structure to suppress the coupling effect between the power via and the digital signal line.

並列關鍵字

Power Via ； Ground Bounce Noise ； Ground Via

參考文獻

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