打線製程異常分析與改善以提升生產效率

IC產業在台灣有非常重要的地位，從上游IC設計、中游晶圓製造到下游的晶片封裝測試，當然每一段半導體產業鏈都很重要，其中封裝扮演重要的角色，當然部分還是以代工為主，不論在半導體、光通訊、LED產業中，封裝的製程中一定有打線，在業界多家競爭產業中，當然產能及品質的提升是最重要的。在每月進行良率討論會議中，對於光電半導體打線製程，本次研究針對不良率部分進行分析討論並提出改善方法，本實驗利用新QC七大手法中的系統圖來做分析及後續處理辦法，並依照最容易發生的根因做驗證改善，其中最可能的原因之一為人員鎖螺絲所導致衍生出的問題，如金球過大、金球偏移等。經由使用治具的改善，利用定位銷及壓條方式將產品固定，並搭配打線治具壓板及熱板來使用，不但降低了異常的問題，並且能延續前一站固晶製程的治具使用，最後減少治具轉換及拆裝螺絲的時間92%，產能一天提升136%。此外利用電漿清洗提升拉力23.22%與推力16.52%，除了品質提升外也減少打不沾黏或斷線的異常發生，確認打線前電漿清洗的重要性。

關鍵字

打線

並列摘要

The IC industry has a significant place in Taiwan from upstream IC design to downstream packaging and testing with midstream wafer manufacturing. Certainly, very important is each section of the semiconductor industry chain, of which packaging plays a key role. Definitely, OEM mainly dominates the packaging sector. No matter how the industries of semiconductor, optical communications, and LED produce products, wire bonding of the packaging process is essential. In these fields, it is the most important that many competitors surly improve production capacity and quality. In the monthly meeting of yield rate discussion, for optoelectronic semiconductor wire bonding, this study analyzed and discussed the defect rate, and proposed improvement methods. Its experiments used a tree diagram of novel seven Management and Planning tools to analyze their results and follow up further actions, as well as, the analytic results were verified to find out the most possible root causes to improve. One of the most likely causes was that operators unintentionally lock screws to result in the derivative problems, such as oversize gold ball, gold ball offset, etc. Through fixture improvement, we used positioning pins and hold-down strip to fix the product, and integrated them all together with a pressure plate and a hot plate of wire bonding fixture. Not only they reduced the abnormal problems, but also extended the functionality of the fixture used by die bonding to wire bonding. The fixture improvement finally reduced 92% of the time of fixture transfer and disassembly and assembly of screws, and further improved 136% in the production capacity per day. Besides, we simply used plasma cleaning to enhance the pulling force by 23.22% and the pushing force by 16.52%. In addition to improving the bonding quality, the abnormal occurrences of bonding failure or broken wires ware reduced and the importance of plasma cleaning before wire bonding was confirmed.